Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Fresh PCB Concepts: IPC-6012 Class 3 and High-reliability PCB Manufacturing

07/23/2026 | Team NCAB -- Column: Fresh PCB Concepts
IPC-6012 Class 3 is widely recognized as the benchmark for high-reliability manufacturing. Compared to Class 2, it establishes tighter requirements for plated holes, annular rings, copper wrap, conductor integrity, and inspection criteria. Those requirements reduce manufacturing defects and improve overall product quality. A common misconception is that a Class 3 PCB is inherently reliable. It isn't. IPC-6012 is fundamentally a workmanship and performance specification that defines manufacturing acceptability after the design is complete.

Henniker Plasma Targets Throughput and Process Stability with Stratus Manufacturing Solution

07/20/2026 | Henniker Plasma
Manufacturers scaling a bonding, coating or printing process to full production rarely struggle with the science of surface treatment; they struggle with holding it steady, line after line, shift after shift.

Technica USA to Host PCBA Lunch & Learn Featuring DCT and Rehm Thermal Systems

07/20/2026 | Technica USA
Technica USA has announced its next Lunch & Learn event for PCB assembly (PCBA) customers, scheduled for August 12 and 13. The educational sessions will feature technology experts from DCT and Rehm Thermal Systems, highlighting innovative equipment and process solutions designed to improve manufacturing performance.

Ionic Contamination Debate Highlights Growing Divide in Automotive Electronics

07/15/2026 | I-Connect007 Editorial Team
A recent Global Electronics Association panel discussion revealed both broad agreement and sharp differences regarding one of electronics manufacturing’s most persistent reliability questions: How clean is clean enough? The discussion, focused on ionic contamination assessment in electronic control unit (ECU) manufacturing, brought together the following experts:  Tim Dietz from Ford Motor Company, Dr. Lothar Henneken from Robert Bosch, Eric Camden from Foresite, Hubertus Mertens from MKS’ Atotech, Doug Pauls from It Depends Electronics, and Stan Rak from SF Rak Company, as moderator. While everyone agreed that contamination control is essential for long-term reliability, panelists differed significantly on whether ion chromatography (IC) should play a larger role in production acceptance and process control.

A Roadmap to Faster SMT Changeovers

07/14/2026 | Nolan Johnson, SMT007 Magazine
The top-performing EMS providers—Jabil, Flex, Sanmina, Benchmark, Zollner, and Asteelflash—consistently focus on a foundational Lean manufacturing methodology known as SMED (single-minute exchange of die) to reduce equipment setup and changeover times to under 10 minutes. The four SMED pillars: Offline feeder preparation, Feeder cart exchange systems, Barcode/MES verification, and Dedicated setup technicians. These four changes alone typically deliver 60–80% of total achievable setup time reduction before more advanced automation is even considered.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in