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Flexible Thinking Flexible Circuit Technology—Looking Back and Forward

03/03/2025 | Joe Fjelstad -- Column: Flexible Thinking
Flexible circuit technology came on the scene as a solution largely for niche applications, however, the technology has emerged in recent years as a cornerstone of modern electronics. Today, the technology is enabling a broad range of new product designs across industries. From wearable devices and medical implants to foldable smartphones and numerous automotive applications, flexible circuits are arguably at the heart of much of the next generation of innovations.

J.A.M.E.S. Explores the Future of Additive Manufactured Electronics

02/18/2025 | Marcy LaRont, I-Connect007
Andreas Salomon is chief scientist at J.A.M.E.S, a joint venture of Nano Dimension and HENSOLD. In this interview he discusses the evolving landscape of additively manufactured electronics, highlighting the integration of cutting-edge technologies, such as micro-dispensing and ink jetting. These technologies enhance capabilities in signal integrity and miniaturization. He also talks about the importance of sustainability, the need for standardized testing, and collaboration among industry leaders that will drive innovation and transform the future of electronics manufacturing through IPC’s standards development.

Sunny Kwok Joins Ventec as Technical Sales Representative for UK and EMEA

02/14/2025 | Ventec
Ventec is pleased to announce the appointment of Sunny Kwok as Technical Sales Representative for UK and EMEA regions. Sunny will further enhance service support levels for Ventec full range of materials including non-reinforced resin coated copper and film products (thermal/Pro-bond), high speed/low loss (tec-speed) and Ventec’s full range of halogen free materials for high reliability applications.

Unveiling the Future: Insights on Next-Gen Megtron Materials 

02/13/2025 | Marcy LaRont, I-Connect007
In this interview from DesignCon, Jim Kenny, OEM business development manager at Panasonic, touches on next-generation Megtron materials and delves into the industry's growing demand for high-speed, low-loss laminate systems, particularly in light of the anticipated 224 gigabits per second technology. With a focus on material development and production timelines, Jim highlights the challenges and opportunities in meeting customer needs while also maintaining quality and supply chain stability. As Panasonic prepares for the evolving landscape, they remain committed to innovating in this competitive market.

DuPont to Discuss Development of EUV Photoresists at SPIE Advanced Lithography + Patterning Conference

02/13/2025 | DuPont
DuPont today announced its participation in the 2025 SPIE Advanced Lithography + Patterning conference, taking place Feb. 24–28 in San Jose, California. DuPont will showcase its latest innovations through technical presentations focused on the development of photoresists for extreme ultraviolet (EUV) lithography and advancing sustainability in the design of lithographic materials.
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