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Advanced Electronics Packaging Digest

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Benchmark to Ring NYSE Closing Bell

11/02/2026 | BUSINESS WIRE
Benchmark Electronics, Inc., a global provider of engineering, design and manufacturing services, announced that President and Chief Executive Officer David Moezidis and his senior leadership team will participate in the Closing Bell ceremony at the New York Stock Exchange (NYSE) on Monday, November 2, 2026, at 4:00 p.m. ET, celebrating the company's 30th year on the exchange.

Plexus Announces Fiscal Q4, Fiscal Year 2026 Financial Results

11/02/2026 | Plexus
Plexus Corp. announced financial results for our fiscal fourth quarter and fiscal year ended October 3, 2026, and guidance for our fiscal first quarter ending January 2, 2027.

Foxconn Industrializes Intelligence and Scales the Future With AI Factories

10/30/2026 | Foxconn
Foxconn is building an AI factory that turns industrial data into intelligence to power a self-learning manufacturing ecosystem.

Murata to Expand Production Capacity of Multilayer Ceramic Capacitors Going Forward

10/30/2026 | Murata
Murata Manufacturing Co., Ltd. (Murata) will expand its global production capacity of multilayer ceramic capacitors (MLCCs) by 2030 to meet medium- to long-term demand growth.

ESCATEC Completes New Control Room to Support Medical Manufacturing in the UK

10/30/2026 | ESCATEC
Electronics manufacturing services (EMS) provider ESCATEC has completed the development of a new control room at ESCATEC Mechatronics Ltd (EUK) in Lutterworth, UK.
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