-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Indium Corporation Announces New Corporate Leadership
January 11, 2018 | Indium CorporationEstimated reading time: 2 minutes

Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving as the Chairman of the Board.
Evans has been with Indium for 36 years. He began as a technical support engineer and quickly rose to product line manager, helping expand the company’s product lines into the SMT assembly field. As division director for Indium's electronics assembly materials, he guided the steady growth of the solder paste product line and instituted a formal corporate R&D function. Evans eventually became the VP of manufacturing and sales, overseeing the expansion of the company's manufacturing footprint and sales structure in the UK, Singapore, China, South Korea, and Malaysia, and addressing the growing global demand for Indium products. Evans was named president and COO in 1997, leading the company’s growth from dozens of people to over 800 and from one factory in Utica, New York to 12 facilities, worldwide. Under his leadership, Indium has earned numerous awards, honors, and recognition due to the strengthening of corporate culture and performance.
Evans earned his AAS in Engineering Science from Mohawk Valley Community College, his BS in Chemical Engineering from Clarkson University, and his MBA from Rensselaer Polytechnic Institute.
“Greg’s leadership has propelled Indium Corporation to the position of more than just an electronics assembly materials manufacturer and supplier of choice, but also an employer of choice,” Macartney III said. “I very much look forward to continuing our close work together as we spend many more years dedicated to the success of Indium Corporation and strengthening the company. Together, we are equally dedicated to the success of each member of the Indium Corporation family, and will work to secure our futures, achieve everyone’s potential, and uphold our company culture – The Indium Way.”
As CEO, Evans will focus, primarily, on the company’s long-term mission and strategies. His work will ensure the ongoing growth and vibrancy of Indium.
Berntson joined Indium in 1996 as a product specialist. He quickly rose to the roles of product manager, marketing leader, sales leader, tech support leader, and, most recently, as executive vice president. Berntson is an active member of numerous industry organizations, including IPC, iNEMI, IMAPS, and SMTA. He has published several technical papers and articles, and presented at technical conferences globally. Berntson has a master’s degree in business administration and a bachelor’s degree in chemistry from Cornell University, where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.
“Over the past 20 years, Ross has been intelligent and strategic in his results-driven approach to leadership at Indium Corporation,” Evans said. “I look forward to continuing to work alongside Ross as we further secure Indium Corporation’s position as the global leader in quality electronics assembly materials and technical support.”
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.