Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
Nexperia Introduces New Generation of High Performance In-Vehicle Network Protection Diodes
December 14, 2017 | NexperiaEstimated reading time: 1 minute
Nexperia, the former Standard Products division of NXP, today announced a new generation of in-vehicle network (IVN) protection diodes that offer a higher surge current, greater ESD robustness and a significant improvement in ESD clamping performance. The new AEC-Q101 qualified PESDxIVN series of surface mount devices is optimized for the latest generation of CAN, LIN, and FlexRay transceivers.
The new parts are drop-in replacement for legacy devices, available in familiar SOT23, SOD323 and SOT323 packages. However the new parts deliver higher performance. For example, PESD2IVN24-T parts deliver a 30 kV ESD robustness (up from 23 kV on the legacy PESD1CAN), an improved surge current of 3.5 A and much better clamping of 42 V at 3.5 A (was 70 V at 3 A). Other parameters remain constant or slightly better. The PESD1IVN27-A offers the same improvement in ESD robustness with a lower (=better) clamping voltage compared to the legacy PESD1LIN.
Commented Nexperia’s Marketing Manager Automotive André Dressler: “In modern vehicles there is an increasing amount of data exchange and the electronic content is growing in functionality and complexity, therefore effective ESD protection solutions are imperative. Nexperia has brought on-line a massive capacity increase for ESD diodes in order to guarantee a secure chain, and provide customers with peace of mind that they are protecting the electronics in their vehicles with high-performance, rugged and efficient devices.”
About Nexperia
Nexperia, the former Standard Products division of NXP, is a dedicated global leader in Discretes, Logic and MOSFETs devices. The company became independent at the beginning of 2017. Focused on efficiency, Nexperia produces consistently reliable semiconductor components at high volume: 85 billion annually. Our extensive portfolio meets the stringent standards set by the Automotive industry. Industry-leading, miniature packages, produced in our own manufacturing facilities, combine power and thermal efficiency with best-in-class quality levels.
With over 50 years history supplying to the world’s biggest companies, Nexperia has 11,000 employees across Asia, Europe and the U.S., offering global support. The company has an extensive IP portfolio and is certified to ISO9001, ISO/TS16949, ISO14001 and OHSAS18001.
For more information, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).