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epoxySet Launches UV-8675 – Deep Section, UV Cured Adhesive for PVC

02/19/2025 | epoxySet
epoxySet   introduces the UV-8675, acrylated urethane adhesive for bonding PVC, polycarbonate and most other plastics.  Designed for bonding PVC tubing in medical devices, it also bonds well to glass and metals. This semirigid polymer offers high bond strength without causing stress cracks. 

Swissbit Unveils PCIe Gen4 SSD A1200

02/04/2025 | Swissbit
Swissbit introduces the latest addition to its PCIe portfolio, the new A1200. The PCIe Gen4 M.2 SSD is designed to meet the demands of high-performance, mission-critical applications, focusing on consistent performance, low latency, and data integrity.

AIM Solder to Declare 2025 the Year of Type 5 at IPC APEX EXPO 2025

02/03/2025 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce its participation in the upcoming IPC APEX Conference and Expo, held at the Anaheim Convention Center in California from March 18-20, 2025.

Indium to Showcase Durafuse Solder Technology at NEPCON Japan

01/21/2025 | Indium Corporation
As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025

01/16/2025 | Indium Corporation
Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.
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