MKS’ Atotech Showcases Advanced PCB Solutions at CPCA Show Plus 2026

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MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest manufacturing solutions for printed circuit board (PCB) and package substrate production at CPCA Show Plus 2026. The exhibition will take place October 27-29 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.

At booth 6D11, MKS will showcase an integrated portfolio of process chemistries, plating equipment, laser systems, digital manufacturing solutions, and technical services for PCB and package substrate production. Together, these technologies support MKS’ proprietary Optimize the Interconnect® approach, helping manufacturers address increasingly demanding requirements for interconnect density, reliability, yield, and production efficiency.

The portfolio on display will address key manufacturing requirements associated with artificial intelligence, high-performance computing, automotive electronics, advanced packaging, and next-generation communications, including fine-line formation, via filling, surface finishing, bond enhancement, precision laser processing, and manufacturing digitalization.

Enabling next-generation interconnect innovation

As artificial intelligence, advanced packaging, and high-performance computing drive finer features and more complex interconnect structures, manufacturers need greater integration across laser processing, metallization, plating, and process control,” said Eddy Chen, Marketing Manager Electronics Greater China at MKS’ Atotech. “At CPCA Show Plus, we will demonstrate how MKS technologies from Atotech and ESI help customers address these interconnected manufacturing challenges while improving performance, productivity, and reliability.”

Technology highlights

MKS’ Atotech will showcase technologies that support the industry’s transition toward AI-driven electronics, advanced packaging, high-density interconnects, and digitalized manufacturing environments.

Printoganth® MV TP2 / TP3 – High throwing power vertical electroless copper process for SAP/amSAP applications, enabling ultra-thin copper deposition for features down to 2/2 µm L/S

Printoganth® P2 – Advanced horizontal electroless copper process for high-frequency and flexible applications

Advanced packaging & via filling

• Cupraganth® MV Activation – Pd-free copper activation technology for advanced packaging applications
• Inpulse® 2THF2 – Through-via filling solution for IC/CSP substrates
• InPro® SAP7 – High-uniformity via filling for next-generation package substrates
• InPro® Pulse TVF – Through-via filling technology for enhanced thermal management

Surface finishes & reliability

• Aurotech® G-Bond 3 – Versatile gold plating solution supporting Ni/Au, Ni/Pd/Au, and Pd/Au finishes
• Pallabond® 2 – Electroless palladium and autocatalytic gold process for fine-line and high-frequency applications
• Universal Finish Solderbond – ENEPIG finish for soldering and gold- or aluminum-wire bonding applications
• Stannatech® 2100 – Cost-effective immersion tin process delivering excellent whisker control and solder reliability

Advanced packaging bond enhancement

• Novabond® PX-S2 & BondFilm® HF1000 VS – Bond enhancement solutions tailored for high-speed AI, HPC, and high-frequency designs

Equipment & digital manufacturing solutions

• Uniplate® PLBCu6 – Integrated inline process for advanced mSAP applications
• vPlate® ICS – Vertical conveyor plating equipment for next-generation HDI PCB and package substrate manufacturing
• POLYGON PLB LINE® – Advanced line technology enabling superior blind microvia performance for HDI PCB production
• Digital Factory Suite – Industrial digitalization solutions that improve performance and reduce operational costs

Laser platforms (ESI Products)

• Geode™ Platform Solutions – Advanced CO₂ and UV laser systems for PCB and package substrate via formation.
• Geode™ G2 – Next-generation CO₂ laser drill engineered for precision HDI and IC packaging applications.
• CapStone™ Flex PCB laser drill – Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%
• Optimizing the Interconnect across the manufacturing flow

By combining advanced chemistry, precision plating, laser processing, automation, and digital manufacturing solutions, MKS delivers an integrated ecosystem that helps manufacturers improve yield, reliability across the manufacturing flow.