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Scale-out: From Individual Servers To Interconnected Compute Systems

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The semiconductor industry is moving beyond traditional chip-level scaling toward interconnected computing architectures. Growing demand for AI, high-performance computing (HPC), and data-intensive applications requires greater computing capacity, memory bandwidth, and communication efficiency. As we know, advanced packaging plays an important role in supporting the semiconductor technologies that enable these systems. While scale-up increases the capability of tightly coupled computing systems, scale-out enables those resources to work together at a larger infrastructure level.

Panasonic to Invest ¥92B in AI-related Business Expansion

11/02/2026 | Panasonic Industry Co., Ltd.
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Server CPU Shipments to Grow Over 40% in 2027 as Arm Gains Share

10/23/2026 | TrendForce
TrendForce’s latest AI server industry research indicates that demand for server CPUs has grown steadily since the second half of 2025 as AI service providers actively introduce AI agent applications. Server CPU shipments are projected to increase 31% YoY in 2026. 

Server CPU Shipments to Grow Over 40% in 2027 as Arm Gains Share

10/22/2026 | TrendForce
TrendForce’s latest AI server industry research indicates that demand for server CPUs has grown steadily since the second half of 2025 as AI service providers actively introduce AI agent applications. Server CPU shipments are projected to increase 31% YoY in 2026.

KAGA Electronics Signs Contract Manufacturing Agreement with Star seeds for AI Servers

10/13/2026 | KAGA ELECTRONICS
KAGA ELECTRONICS CO., LTD. hereby announces that it has entered into a basic agreement with Star seeds Co., Ltd., an AI infrastructure provider offering end-to-end solutions entirely within Japan, from GPU procurement to AI data center construction and operation.
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