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MKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands Atotech, offering process chemicals, equipment, software, and services, and ESI, offering laser systems, will showcase integrated manufacturing solutions in advanced packaging, package substrate, and printed circuit board (PCB) manufacturing at KPCA Show 2026 held at Songdo Convensia in Incheon, South Korea, from September 9–11. Visitors can meet MKS’ representatives at booth 201 in hall 3 and discover the company’s latest solutions for advanced electronics manufacturing.
As artificial intelligence (AI) and high-performance computing drive demand for advanced semiconductor packaging, high-density interconnects and increasingly complex package substrates, manufacturers must achieve greater performance and reliability while maintaining efficient, scalable production. At KPCA 2026, MKS will demonstrate how its integrated portfolio of laser processing, plating equipment, process chemistry and digital process management supports these requirements across PCB and package substrate manufacturing. “AI is reshaping the requirements for semiconductor packaging and PCB manufacturing,” said Avery Kim, Regional Marketing Manager Korea and SEA, MKS. “Customers increasingly need tightly integrated process technologies that improve both performance and manufacturing efficiency. At KPCA Show 2026, we will demonstrate how our combined chemistry, laser and digital solutions help address those challenges.”
The portfolio reflects MKS’ Optimize the Interconnect℠ approach, which brings together laser drilling, metallization, process chemistry and digital process management in an integrated manufacturing approach. By connecting technologies across the production flow, MKS supports customers improve yield, reduce process variability and lower total manufacturing costs.
MKS will highlight technologies addressing high-aspect-ratio through-glass vias (TGVs), advanced package substrates, semi-additive processing (SAP) and flexible circuit production. The portfolio combines global development capabilities with local technical and application support to help manufacturers transfer new processes into scalable production.
Technology Highlights
MKS will feature a broad range of advanced process and equipment solutions, including:
Atotech process chemistry
- Printoganth® P2: Advanced horizontal electroless copper process offering superior throw into blind microvias and nano-void-free deposits for high-frequency and flexible applications.
- Printoganth® MV TP3 series: Electroless copper process for SAP build-up and next-generation IC substrates, providing uniform ultra-thin copper deposition and reliable adhesion on low-roughness ABF materials.
- InPro® Pulse TGV: Advanced copper filling for high-aspect-ratio through-glass vias
- NovaBond® PX-S2: Ultra-low-roughness adhesion promoter combining selective nano-roughening with chemical bonding to preserve trace geometry and support signal integrity, thermal reliability and bonding strength.
- EcoFlash® S 300 U: Differential etching process for advanced SAP manufacturing
- Aurotech® G-Bond 3: Versatile gold plating solution supporting Ni/Au, Ni/Pd/Au, and Pd/Au finishes
- Argalin XL: High-performance anti-tarnish treatment designed to protect silver surfaces under demanding thermal and corrosive conditions.
Atotech Equipment solutions include:
- G-Plate®: Vertical desmear and electroless copper plating platform for high-volume manufacturing of next-generation package substrates.
- vPlate®: Vertical continuous copper-plating equipment for advanced pattern plating in HDI PCBs, substrate-like PCBs and package substrate applications, including SAP and mSAP.
ESI laser platforms
- Capstone™: Flex PCB UV drilling tool for high-performance breakthrough productivity
- 5335™ flex PCB laser drill: Best-in-class high-volume FPC laser drilling machine for flexible PCB manufacturing
- Geode Next-generation PCB and advanced substrate CO2 and UV laser via drills
Visitors can meet MKS experts to discuss manufacturing challenges and explore Atotech and ESI technologies for advanced packaging, package substrates, flexible circuits and HDI PCB production.
