Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Everspin, Teledyne HiRel Partner to Accelerate MRAM Adoption in Aerospace and Defense

09/02/2026 | BUSINESS WIRE
Everspin Technologies, Inc., the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, defense and other demanding systems.

Everspin Executes $40M Agreement for Mil-Aero MRAM Applications

04/30/2026 | Everspin Technologies, Inc.
Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.

Mycronic’s Global Technologies Makes Acquisition in France

03/13/2025 | Mycronic
Mycronic’s Global Technologies division has acquired Hprobe, a company headquartered in Grenoble, France, which has developed a unique technology for high-speed magnetic testing of Magnetoresistive Random Access Memories (MRAMs) and magnetic sensors.

Everspin Technology, Lattice Semiconductor Collaborate

02/20/2025 | BUSINESS WIRE
Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, today announced that its PERSYST MRAM is now validated for configuration across all Lattice Semiconductor Field Programmable Gate Arrays (FPGA).

Avalanche Technology, UMC Announce 22nm Production of High-Density MRAM-Based Devices

09/12/2022 | Business Wire
Avalanche Technology, the leader in next-generation MRAM technology, and United Microelectronics Corporation (UMC), a leading semiconductor foundry, announced the immediate availability of new High-Reliability Persistent SRAM (P-SRAM) memory devices through UMC’s 22nm process technology.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in