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Suggested Items

Summit Interconnect Celebrates 10 Years

07/28/2026 | Marcy LaRont, I-Connect007 Magazine
Ten years ago, Shane Whiteside had a vision for the dwindling North American PCB industry: to develop a company at scale that would put North American PCB manufacturing back on the map. The result was the combination of six PCB organizations and complementary businesses to create Summit Interconnect, now the second-largest PCB manufacturer in North America. In this interview, Summit CEO Shane Whiteside and Vice President of Technology Gerry Partida reflect on Summit's 10th anniversary, the pride they take in what they've built, and the enthusiasm they still bring to the business as they celebrate this milestone.

FDH Electronics Appoints Connector & Wire Services (CWS) as Official Representative for South Africa

07/27/2026 | Globe Newswire
FDH Aero, a leading global provider of supply chain solutions for the aerospace and defense industry, announced that FDH Electronics, an FDH Aero division serving the mil-aero market’s electronic component needs, has appointed Connector & Wire Services (CWS) as its official sales representative for South Africa.

ESCATEC Expands Smart Manufacturing Capabilities with New Automated Line in Penang

07/27/2026 | ESCATEC
Global EMS provider ESCATEC has further strengthened its smart manufacturing capabilities with the installation of a highly automated assembly line at ESCATEC Electronics (EEM) in Penang.

Kurtz Ersa Partners with E-tronix for Sales in Illinois and Wisconsin

07/23/2026 | Kurtz Ersa
Kurtz Ersa Inc., a leading supplier of electronics production equipment, has entered into a new representative agreement with E-tronix to support customers in Illinois and Wisconsin. Under the agreement, E-tronix will provide sales support for Kurtz Ersa’s soldering, reflow, and rework equipment across the region.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.
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