Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

The European PCB and Electronics Industries Score a Major Win in Chips 2.0 Milestone

06/15/2026 | Marcy LaRont, I-Connect007
Anyone who has spent time in the PCB industry knows the frustration: electronics policy discussions often begin and end with semiconductors. Yet chips don't function in a vacuum, and increasingly, policymakers are beginning to recognize that reality. In what many consider a landmark moment for the European electronics ecosystem, the proposed Chips Act 2.0 broadens its scope to include electronics manufacturing and explicitly identifies printed circuit boards as a strategic technology. I caught up with Alison James to talk about the significance of this milestone, the years of advocacy behind it, and what comes next as the legislation moves through the European Union's complex approval process.

EIPC Summer Conference 2026: AI, Robots, and Historic Vilnius, Lithuania

06/15/2026 | Marcy LaRont, I-Connect007
Historic downtown Vilnius, Lithuania, hosted the sold-out EIPC Summer Conference, June 9–10, where 175 participants gathered at the AC Hotel, including representatives from the Global Electronics Association, FED, and four other industry associations. This year also included representation from 14 European PCB companies, and one—TTM— from the U.S., something that hasn’t happened for quite some time.

CEA-Leti, GlobalFoundries Advance European FD-SOI Innovation via FAMES Pilot Line

06/11/2026 | CEA-Leti
CEA‑Leti, a leading European research institute for microelectronics, reaffirmed its long‑standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two decades of joint work on fully depleted silicon‑on‑insulator (FD‑SOI) technology and reinforcing Europe's leadership in energy‑efficient, sovereign semiconductors.

Airbus Defence and Space Forms Sovereign Space Intelligence Consortium

06/10/2026 | Airbus Defence and Space
Airbus Defence and Space has signed a Memorandum of Understanding with Rohde & Schwarz, constellr, Orbint and High Performance Space Structure Systems (HPS) to collaborate on a satellite-based Earth observation and Intelligence, Surveillance, and Reconnaissance (ISR) solution.

GlobalFoundries, Qualinx Demonstrate First European Sovereign Chip Manufacturing Flow

06/10/2026 | BUSINESS WIRE
GlobalFoundries (GF) and Qualinx announced the successful completion of the first fully European-based, end-to-end semiconductor manufacturing flow at GlobalFoundries’ Dresden fab on its FDX technology.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in