Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Gov. Hochul, TTM Technologies Mark Opening of $130M Manufacturing Facility in Dewitt

06/24/2026 | New York State Government
Governor Kathy Hochul announced the completion of TTM Technologies, Inc.’s new manufacturing facility located in Central New York. A leading global manufacturer of technology solutions, the company’s new state-of-the-art manufacturing facility is co-located on approximately 23 acres adjacent to TTM’s existing production facility in the Town of DeWitt, Onondaga County.

Onshoring Advanced Packaging and Assembly Workshop

06/24/2026 | Global Electronics Association
Hosted by IMAPS and Global Electronics Association, the Onshoring Advanced Packaging Workshop will be held Aug 31 - Sep 2, 2026, bringing together the U.S. Government, DIB (Defense Industrial Base), and key stakeholders to drive microelectronics packaging and assembly onshoring.

Teledyne FLIR Defense Wins $28.8M CBP Contract for Mobile Surveillance Systems

06/24/2026 | BUSINESS WIRE
Teledyne Technologies Incorporated announced that Teledyne FLIR Defense has won a $28.8 million contract from U.S. Customs and Border Protection (CBP), an agency of the U.S. Department of Homeland Security, to support the agency’s Enhanced Mobile Surveillance Capability–Lite (eMSC-L) program to bolster border security operations.

Safran, SatSure Forge a Strategic Partnership to Advance Geospatial Intelligence (GEOINT)

06/23/2026 | Safran
As part of the France-India Year of Innovation, Safran Electronics & Defense and SatSure have signed a Memorandum of Understanding (MoU) to formalize their collaboration in Geospatial Intelligence (GEOINT). 

TTM Technologies Opens Ultra-HDI Manufacturing Facility in Syracuse, NY

06/23/2026 | TTM Technologies
TTM Technologies, Inc., a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in