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Akrometrix Discusses AI Chip Board Demands
March 27, 2026 | Real Time with... APEX EXPOEstimated reading time: Less than a minute
Paul Handler of Akrometrix discusses the evolving demands in PCB fabrication, particularly the surge in large-format, room-temperature boards for AI chips. He highlights the critical need for inline, real-time testing of heavy, high-value circuit boards and Akrometrix's strategic shift towards integrated Industry 4.0 solutions. Handler also highlights the engineering challenges and the company's positive outlook for industry growth.
APEX EXPO 2026 has concluded successfully. If you couldn’t make it to the show, don’t worry, the I-Connect007 team has coverage of the entire week’s events. Watch your inbox on Fridays over the next several weeks for our complete coverage, delivered directly to your inbox, or visit Real Time with… APEX EXPO 2026 now for video interviews with the movers and shakers of the electronics industry.
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Julia McCaffrey - NCAB GroupSuggested Items
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
Siborg LCR-Reader Professional Multimeter
04/16/2026 | Real Time with... APEX EXPOMichael Obrecht showcases the LCR-Reader professional benchtop multimeter from Siborg Systems Inc. Obrecht discusses the compact, Canadian-made device that offers the functionality of expensive benchtop meters at an accessible price. He details versatile measurement capabilities, including LCR, ESR, resistance, capacitance, and advanced features like signal generation and oscilloscope mode.
A 60-Year Legacy of PCB Innovation from IEC
04/17/2026 | Real Time with... APEX EXPOChris Hrusovsky, director of business development for International Electronic Components (IEC), shares his company’s commitment to customer partnerships, seamless service, and technical support for fabricators. Chris updates us on technological advancements in direct imaging, copper-filled vias, and the company's global collaborations driving innovation in consumables and equipment.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.