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I-Connect007 Magazine: AI, Tolerances, Flexible Circuits, and More
March 17, 2026 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In the spirit of March Madness, the latest issue of I-Connect007 Magazine tackles a full bracket of topics engineers face on real boards, from AI-powered design tools and cumulative tolerances to copper pours, etch factors, flexible circuits, and solder mask details.
We also explore the bigger forces shaping the industry, including U.S. microelectronics manufacturing efforts, new legislation, and the role of UL certification in ensuring reliability.
You’ll meet Emily Daley, the Student Board Member for the Global Electronics Association, who’s helping represent the next generation of industry leaders, and read about Steve Williams’ career journey through the PCB world. We also look at emerging technologies such as ReRAM and novel copper extraction, along with coverage from DesignCon 2026.
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