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At CES, Qualcomm Technologies, Inc. introduced a next-generation robotics comprehensive-stack architecture that integrates hardware, software, and compound AI. Qualcomm Technologies also unveiled its latest high performance robotics processor for industrial AMRs and advanced full-size humanoids, the Qualcomm Dragonwing™ IQ10 Series. This is the latest robotics-specific processor which expands the current robotics roadmap for the Company, delivering high performance, energy-efficient “Brain of the Robot” capabilities. Utilizing Qualcomm Technologies’ proven expertise in edge AI, high performance, low-power systems, this innovation transforms prototypes into deployable, intelligent machines.
“As pioneers in energy efficient, high–performance Physical AI systems, we know what it takes to make even the most complex robotics systems perform reliably, safely, and at scale,” said Nakul Duggal, EVP and Group General Manager, Automotive, Industrial & Embedded IoT and Robotics, Qualcomm Technologies, Inc. “By building on our strong foundational low-latency safety-grade high performance technologies ranging from sensing, perception to planning and action, we’re redefining what’s possible with physical AI by moving intelligent machines out of the labs and into real-world environments.”
“Figure's mission is to develop general-purpose humanoid robots powered by advanced AI to eliminate unsafe and undesirable jobs, boost productivity across industries, and create economic abundance that enables happier, more purposeful lives for humanity,” stated Brett Adcock, Founder & CEO, Figure. “Qualcomm Technologies’ platform, with its combination of exceptional compute capabilities and energy efficiency, is a valuable building block in enabling Figure to turn our vision into reality."
Building on a Proven Foundation: From Concept to Deployment
This general-purpose robotics architecture utilizes Qualcomm Technologies’ expertise in power efficiency, scalability, and edge AI performance to unlock a new era of autonomous robotics and connected intelligence. Today, the Dragonwing industrial processor roadmap powers an assortment of general-purpose robotics form factors, including industry-leading humanoid robots from Booster, VinMotion, and other global robotics providers. This architecture supports advanced perception, motion planning with end-to-end AI models such as VLAs and VLMs enabling generalized manipulation capabilities and human-robot interaction. The introduction of the Dragonwing IQ10 helps Qualcomm Technologies take a significant step toward practical, real‑world deployment across industrial applications. Qualcomm Technologies is engaged in discussions with Kuka Robotics for their next-generation robotics solution.
Comprehensive Stack Architecture
The general-purpose robotics architecture with the Dragonwing IQ10 redefines what’s possible in robotics by combining powerful heterogeneous edge computing, edge AI, mixed-criticality systems, software, machine learning operations, and an AI data flywheel, supported by a growing partner ecosystem and complemented by a strong suite of developer tools. This end-to-end approach enables robots to easily reason and adapt to the spatial and temporal environment intelligently and is optimized to scale across various form factors with industrial-grade reliability. This collaborative network accelerates the development of deployment-ready robotics solutions, solving the last-mile challenge and enabling faster, more scalable innovation across industries.
Experience the Qualcomm-Powered Humanoids at CES
VinMotion’s Motion 2 humanoid, powered by the Qualcomm Dragonwing™ IQ9 Series will be displayed at the Qualcomm Booth #5001 during CES. Also featured at the booth, Booster’s K1 Geek highlights Qualcomm Technologies’ leadership in edge AI, underscoring the Company’s commitment to advancing physical AI for developers and organizations alike. Qualcomm Technologies is also demonstrating Advantech’s commercially available robotics development kit for rapid, multi‑application development and deployment. Separately, the booth features an in-depth look into teleoperation tooling and an AI data flywheel for collection, training, and deployment to continuously add new skills across robotic form factors.
