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Lockheed Martin, Diehl Defence Announce Strategic Collaboration
November 21, 2025 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin and Diehl Defence have signed a Memorandum of Understanding to explore the expansion of integrated air and missile defense (IAMD) capability to our partner nations around the world.
The collaboration will enable us to work together on adding advanced IAMD capability by exploring the integration of the IRIS‑T family into the Aegis Weapon System and the MK41 and MK70 Vertical Launching System. Integrating the IRIS‑T family into Aegis would be the first European missile ever integrated into the combat system.
Executive Perspectives
“This strategic collaboration continues to showcase the scalability and increased capacity of our programs, which bring next‑generation IAMD capability and 21st century security worldwide,” said Chandra Marshall, vice president at Lockheed Martin. “We have partnered with German industry for more than five decades, and we are proud to deepen our relationships by working with leading innovators such as Diehl Defence.”
Helmut Rauch, CEO of Diehl Defence said, “With Diehl Defence and Lockheed Martin linking up their expertise and capabilities, navies around the globe can benefit from the optimum for air defence systems on their surface combat vessels. We are proud to intensify our collaboration with Lockheed Martin in the field of guided missiles and the air defence applications.”
Our global industrial partnerships provide meaningful scope that creates jobs and investment in the global supply chain, creating local security and strengthening economies, industries and communities.
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Simon Khesin - Schmoll MaschinenSuggested Items
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EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates
04/21/2026 | Alison James and Chris Mitchell, Global Electronics AssociationThe European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks