-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
APEX EXPO 2026 Preshow
This month, we take you inside the annual trade show of the Global Electronics Association, to preview the conferences, standards, keynotes, and other special events new to the show this year.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Tesla Weighs Building ‘Gigantic’ Chip Fab to Meet AI Demand
November 17, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Tesla CEO Elon Musk said the company will probably need to build a “gigantic” semiconductor fabrication plant to support its expanding artificial intelligence and robotics plans, CNBC reported.
“One of the things I’m trying to figure out is — how do we make enough chips?” Musk said at Tesla’s annual shareholders’ meeting on Nov. 6.
Tesla now relies on Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics to produce its chip designs, and Musk has also considered Intel as a potential partner. “But even when we extrapolate the best-case scenario for chip production from our suppliers, it’s still not enough,” he said at the meeting.
He added that Tesla would probably need to build what he described as a “Tesla terra fab,” noting, “I can’t see any other way to get to the volume of chips that we’re looking for.”
Demand for semiconductors has surged as the AI boom drives competition among tech companies for more supply. According to Musk, a potential Tesla fab would start with a capacity for 100,000 wafer starts per month and scale up to 1 million. By comparison, TSMC produced the equivalent of about 1.42 million wafer starts per month in 2024.
Tesla does not currently manufacture its own microchips but has been designing custom chips for autonomous driving. It is outsourcing production of its new “AI5” chip, which Musk said will be cheaper, more power-efficient, and optimized for Tesla’s AI software.
Musk also said Tesla will begin producing its Cybercab, an autonomous electric vehicle with no pedals or steering wheel, in April 2026.
“With AI and robotics, you can actually increase the global economy by a factor of 10, or maybe 100. There’s not, like, an obvious limit,” he said.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Women in Electronics Keynote Review: A Life and Career Filled With Humor
04/03/2026 | Michelle Te, I-Connect007In an industry that was dominated by male comedians, Jan McInnis quickly learned an important tip to help her succeed in the business: Don’t ask for permission to be yourself. “Don’t try to be something you’re not,” she said after headlining the Women in Electronics event at APEX EXPO 2026. “They’re paying for you and what you bring to the table, so put your blinders on, and just do your thing.”
Educational Highlights From the APEX EXPO 2026 Show Floor
03/27/2026 | Kimberly Kutnick, Global Electronics AssociationAPEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.
Webinar Review, Part 1: A Packaging Revolution Powering the Next Era of AI Compute
03/15/2026 | Marcy LaRont, I-Connect007The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.
American Standard Circuits to Exhibit at the Seattle BCI Defense and Aerospace Summit 2026
03/10/2026 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits and ASC Sunstone, has announced that his company will be attending the Seattle BCI Defense and Aerospace Summit to be held March 18-19, 2026, at the Washington State Convention Center in Seattle, Washington.
Technology Pavilion Debuts at APEX EXPO 2026
02/26/2026 | Global Electronics AssociationMany of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.