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Peters Spotlights ELPEPCB® HSP 801 S at productronica
October 22, 2025 | PetersEstimated reading time: 1 minute
The ELPEPCB® HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025, the coatings manufacturer from Germany’s Lower-Rhine Area will be presenting the system’s high thermal conductivity of 3 W/mK to an international audience of experts. At booth B3-343 of the exhibition center located in Munich-Riem , Peters will recommend ELPEPCB® HSP 801 S with outstanding features as the latest in heatsink pastes for the thermal-management of printed circuit boards and flat assemblies.
Great layout flexibility
The single-component epoxy-based heatsink paste for screen and stencil printing offers industrial users extensive layout flexibility. Besides its thermal conductivity and high glass transition temperature (Tg beyond 150° C), the heatsink paste distinguishes itself by a low thermal expansion coefficient and impressive dielectric strength (DC). The S in the brand ELPEPCB® HSP 801 S stands for low surface roughness, which enables optimal thermal coupling in combination with high thermal conductivity.
Further details on the performance of Peters heatsink paste will be explained by Sven Kramer in his presentation on the first day of the trade fair, 18 November, from 2 to 2.30 p.m. in Hall B3, not far from the Peters booth. This presentation held at the PCB & EMS Forum by the Global Manager of Application Technology is entitled ”The Next Level – Successful Thermal Management with a New Generation of Printable Heatsinks“.
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