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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/03/2026 | Michelle Te, I-Connect007
As a longtime journalist, I always find myself pulled in so many directions of curiosity. I’ve often felt like the saying, “A jack of all trades, master of none.” It seems to be the price I’ve paid as a writer and editor, delving into so many different corners of industry, community, and the human condition. But that’s also why I love this week’s collection of must-reads. From novel flexible circuits to modernizing IPC standards, a trade show in the burgeoning China Plus One region, Mexico’s manufacturing moment, and opportunities for workforce development, we’ve gone around the world and back again. We touch on so many aspects of the industry, and especially the opportunities and challenges of keeping up with change.

Real Time with... THECA 2026: Global Electronics Association on PCB Growth, Standards, and Emerging Technology

09/04/2026 | Real Time with... THECA
David Bergman, VP of International Relations at the Global Electronics Association, talks with Marcy LaRont about his privilege in being involved in THPCA from early on and the strategic opportunity for the Association to make a difference in Thailand's growing electronics industry through standards and education. Also as an active member of the Electronic Circuit World Council (ECWC) (which occurs every three years) Mr. Bergman discusses plans for ECWC17 which will take place next year with THECA 2027, highlighting Thailand's role in electronics manufacturing.

IPC-1751 Builds Supply Chain Infrastructure for the Future

09/01/2026 | Nolan Johnson, I-Connect007
IPC-1751 Committee Chairs Nikki Johnson, VP of operations and regulatory at Source Intelligence, with over 20 years of experience in compliance standards, and Dr. N Nagaraj, a chemical engineer and former NASA contractor who helped develop early IPC compliance solutions, discuss IPC-1751, the newly adopted JSON-based standard that replaces the older XML format. In this roundtable-format conversation, Johnson and Nagaraj explain how IPC-1751 serves as a modular "envelope" that connects related standards (IPC 1752–1757, IPC-1782) for material composition, lab reports, and conflict minerals.

THECA 2026 Review: Innovating PCBs and Advanced Electronics

08/31/2026 | Marcy LaRont, I-Connect007
The Thailand Printed Circuit Association hosted its third annual trade show in the bustling city of Bangkok this past week, under the theme “Innovating PCB and Advanced Electronics with Next-Gen Packaging.” Building on its success as a leading PCB industry exhibition, THECA has brought together the entire PCB value chain, creating a comprehensive platform for advanced electronics.

SEMICON West 2026 to Spotlight $1 Trillion Semiconductor Milestone and Next-Gen Technologies

08/28/2026 | SEMI
SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, announced keynotes and program highlights for this year’s SEMICON® West on October 13–15 at the Moscone Center in San Francisco. Registration is open.
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