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Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
September 25, 2025 | Empower SemiconductorEstimated reading time: 1 minute
Empower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025. With a combination of 20x faster transient response, 2x lower voltage droop and positioning under or near the processor, the Crescendo chipset enables gigawatt-hours (GWh) in energy savings for a typical AI data center. The breakthrough platform will be showcased at the 2025 OCP Global Summit, October 13–16 in San Jose, California.
With a patented architecture, the FinFast™-powered Crescendo chipset is a scalable, 3,000A+ vertical power delivery platform that integrates regulators, magnetics and capacitors in a single ultrathin package that delivers the industry’s fastest transient response—20x faster than traditional solutions—against steep AI and HPC compute power steps. With multi-megahertz (MHz) bandwidth and speed, Crescendo slashes power component sizes to provide 5x higher solution density and cuts power-delivery losses more than 20% by relocating the power conversion elements directly under or near the system-on-chip (SoC). An additional 15% reduction in xPU power and higher processor utilization is achieved for a typical AI workload, resulting in a significantly higher performance per watt metric, driven by Crescendo’s 2x lower voltage-droop response.
“We unveiled Crescendo at last year’s OCP and it immediately captured market attention for the unprecedented performance and energy savings it delivered,” said Tim Phillips, CEO, president and founder of Empower Semiconductor. “With customer designs now well underway, we are set for production by the end of 2025, bolstered by our recent $140M Series D financing that positions us to scale at speed.”
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Nortech Systems Incorporated Earns AS9100 Certification for Monterrey, Mexico Facility
11/04/2025 | BUSINESS WIRENortech Systems, Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced that its Monterrey, Mexico, facility has achieved AS9100:D certification.
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.