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September 2025 PCB007 Magazine: The Future of Advanced Materials
September 16, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
The advancement of materials for printed circuit boards, interconnects/interposers, and substrates is of great interest, and for good reason. Moore’s Law is no more, and the solutions to grapple with this reality are surprising, stunning, and perhaps—for those looking to plate onto them—a bit daunting. They hold amazing potential for the next chapters of the electronics manufacturing journey.
Our advanced materials vendor line-up features Ventec, Isola, Arlon, EMC, Rogers, and AGC, each discussing their solutions (and products) that address high-speed signal integrity, excessive thermal stress and heat management, Dk variability with fine features, and applications that must operate reliably and for long periods of time in harsh environments.
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Brent Fischthal - Koh YoungSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Jiva Leading the Charge Toward Sustainable Innovation
09/30/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.
Space Forge Inc. and United Semiconductors LLC Partner to Develop the Supply Chain for Space-grown Semiconductor Materials
09/29/2025 | Space Forge Inc.Space Forge Inc., the advanced materials company revolutionizing semiconductor manufacturing in space, has announced the signing of a strategic Memorandum of Understanding (MoU) with United Semiconductors LLC, a leading specialist in bulk crystal growth of III-V semiconductor compounds. The agreement formalizes the ongoing collaborative efforts that started over a year ago, marking a significant step forward in strengthening the partnership between the two companies.