Indium Corporation to Showcase Innovative Materials Enabling AI Technology at SEMICON Taiwan

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Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, AI, thin-film, and thermal management markets, will showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs) at SEMICON Taiwan, to be held September 10-12 in Taipei, Taiwan.

Indium Corporation specializes in semiconductor packaging and assembly, offering a portfolio of advanced materials solutions. Committed to the full scope of semiconductor packaging and assembly applications, the company offers right-sized options to align with nearly every application requirement, with a focus on sustainable, energy-efficient technology solutions.

The company will showcase the following among its featured products:

Thermal Solutions

• Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium Reclaim and Recycle Program.
• Heat-Spring® HSx is a compressible, non-reflow metal TIM designed for large-area dies with warpage of 200 microns or more. It delivers 16W/mK thermal conductivity at just 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300 microns to 1mm, it can be customized with or without a diffusion barrier to prevent die staining.
• Solder Thermal Interface Materials (TIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, they enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, they enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting steps.
• Liquid Metal TIMs are designed to offer superior thermal conductivity for both TIM0 and TIM1 applications. Liquid Metal TIMs offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and extraordinary wetting ability to both metallic and nonmetallic surfaces. They are available in a variety of alloys, including InGa and InGaSn.

Sintering Paste

• InFORCE®MF pressure Ag sinter paste with high-metal, low-organic content sinter for SiC die-attach in power electronics. The benefits of a low-organic content composition include short drying for increased throughput and less volume reduction between wet and post-sintered deposits, resulting in less paste being required. Meets reliability requirements for automotive-grade power module assembly.
• InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers. Pressure Cu sinter balances the requirements of high reliability and material cost.
• InBAKE™29 Cu sinter paste is developed for high-power die-attach applications and applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperature. InBAKE™29 can be sintered either pressure-less or with pressure, under low oxygen atmospheres of O2 <500ppm. After 4,500 cycles TCT

(-40°C–175°C). Target applications include high-power die-attach (SiC MOSFET and Si IGBT), RF die-attach, and power LED die-attach.

Flip-Chip Flux

• NC-809 is a halogen-free, ultra-low residue flip-chip flux engineered with high-tack characteristics and designed to hold fine-pitch die or solder spheres in place without risk of shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps, which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
• WS-641 Flip-Chip Flux is a water-washable, halogen-free, dipping flux designed for use in thermocompression bonding and mass reflow, flip-chip copper pillar applications. WS-641 has an activator system powerful enough to promote solder wetting even on mildly oxidized copper and ENEPIG. Its post-reflow residue is easily cleanable with just pure deionized water. It is proven to achieve excellent yield for chip on wafer or chip on substrate application, even down to 40um pitch or less, Cu-pillar attach.
• WS-910 Flip-Chip Flux is designed to provide best-in-class residue cleaning for a water-soluble flip-chip flux, allowing for excellent compatibility with molded and capillary underfill. The new product also offers high tackiness for a flip-chip flux, which is useful when holding large die in place during the reflow process.

Indium Corporation’s Formic Acid Soldering Technology (FAST) product offerings, including preforms, InFORMS®, and novel solder pastes, enable high-reliability, flux-free soldering, ideal for efficient manufacturing of next-generation power electronics.

• InTACK® is a no-clean, no-residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
• NC-702A serves as a tacking agent, holding flip chips in place before the reflow process, similar to traditional flux. With its exceptional tack strength, NC-702A ensures the chip remains securely positioned during reflow.

To learn more about how Indium Corporation’s HIA and TIMs products are enabling AI innovation, visit our experts at booth K2270 at SEMICON Taiwan.