Koh Young Appoints George Hsu to Lead Newly Opened Taiwan Office to Drive Semiconductor and Advanced Packaging Growth
August 18, 2025 | Koh YoungEstimated reading time: 1 minute

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the appointment of George Hsu as Managing Director of Koh Young Taiwan, its newly established branch office in Zhubei City, Hsinchu County.
The opening of the Taiwanese office earlier this year marked a significant milestone in the company’s ongoing global expansion strategy. Positioned in the heart of Taiwan’s thriving semiconductor and electronics manufacturing corridor, Koh Young Taiwan serves as a dedicated hub for advanced packaging and semiconductor customers, as well as the region’s network of global electronics leaders. The branch provides local access to Koh Young’s award-winning inspection and metrology solutions, supported by engineering, applications, and service experts.
The facility features a dedicated demonstration center showcasing Koh Young’s latest portfolio for advanced packaging, semiconductor, and electronics manufacturing applications, with systems purpose-built for wafer-level metrology, system-in-package (SiP) and fan-out wafer-level packaging (FOWLP) applications, and other advanced packaging inspection processes. It also serves as a hub for training, technical support, and collaborative process development, enabling customers to optimize quality, throughput, and yield in highly demanding manufacturing environments.
“Taiwan is one of the most important centers of semiconductor and electronics innovation in the world,” said Hsu. “Our mission is to be more than a solutions provider — we aim to be a trusted partner in our customers’ success. By combining Koh Young’s proven technology leadership with a strong local presence, we will work side-by-side with manufacturers to solve complex challenges, accelerate process optimization, and push the boundaries of what’s possible in advanced manufacturing.”
With George Hsu at the helm, Koh Young Taiwan is well-positioned to deepen customer collaboration, deliver timely solutions, and help manufacturers in Taiwan and beyond achieve the next level of performance in high-reliability electronics and next-generation semiconductors.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Missile Strike on Ukraine Hits Flex Facility
08/22/2025 | FlexOn the morning of August 21, 2025, our facility in Mukachevo, Ukraine, was damaged during a missile strike. Our emergency protocols were executed to ensure the full evacuation of the site.
TPCA Establishes Thailand PCB Academy in Bangkok
08/22/2025 | TPCAA distinguished delegation of distinguished guests from industry, government, academia, and research in Taiwan and Thailand, including representatives from the Ministry of Higher Education, Science, Research, and Innovation (MHESI), the Board of Investment of Thailand (BOI), and the Taipei Economic and Cultural Office in Thailand (TECO), as well as professors from several Thai universities and member companies, attended the historic occasion.
SINBON Celebrates Opening of New US Manufacturing Facility
08/21/2025 | PRNewswireLeading electronics system integrator SINBON Electronics Co., Ltd. held an opening ceremony on August 18 to celebrate its new 59,000-square-foot facility in Clayton, Ohio.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.