Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Jaclyn Kellon, PhD Joins SIA Team
July 21, 2025 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) announced Jaclyn Kellon has joined the association as a director on the global policy team. Jaclyn will be responsible for matters related to supply chain security and cybersecurity, with regional responsibility for Southeast Asia and India.
“As we navigate an increasingly complex global landscape, robust and complementary supply chains are paramount for the continued success of our industry,” said John Neuffer, SIA president and CEO. “Jaclyn has an exceptionally strong track record at the nexus of semiconductor science, policy, and diplomacy, and we are thrilled to welcome her to the SIA team.”
Jaclyn was most recently a foreign affairs officer in the Office of Critical Technology Protection at the U.S. Department of State, where she served as a technical expert on semiconductor technology policy topics to advance Department priorities. In this role, Jaclyn also advocated across interagency, industry, and academic partners for semiconductor technology protection policies designed to maintain technical advantages over strategic competitors. She previously served as a science advisor at the National Nanotechnology Coordination Office (NNCO), collaborating with leadership to develop the NNCO’s 2021 National Nanotechnology Initiative Strategic Plan.
Jaclyn earned a doctorate in nanomaterials chemistry from the University of Oregon and a Bachelor of Arts in chemistry from Goucher College.
Share on:
Suggested Items
SK keyfoundry, in Collaboration with LB Semicon, Co-Develops Direct RDL to Advance Semiconductor Packaging
07/21/2025 | SK keyfoundrySK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon.
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Fraunhofer IPMS, DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
07/17/2025 | Fraunhofer IPMSThe Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor manufacturing.
TI Honored by Volkswagen Group for Operational Excellence
07/16/2025 | Texas InstrumentsTexas Instruments (TI) received the prestigious “Operational Excellence” award at the annual Volkswagen Group Award 2025 in Wolfsburg, Germany.
Report: Broadcom Scraps $1 Billion Chip Investment in Spain
07/15/2025 | I-Connect007 Editorial TeamAmerican chipmaker Broadcom has pulled out of plans to invest in a microchip plant in Spain. According to a July 14 Reuters report, Europa Press, quoting anonymous sources, stated the action followed collapsed government talks but gave no further information.