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3Q25 NAND Flash Contract Prices Projected to Rise 5–10%; Weak Smartphone Demand Limits eMMC and UFS Growth

07/09/2025 | TrendForce
TrendForce’s latest investigations find that the NAND Flash market has seen significant improvement in supply-demand balance following production cuts and inventory reduction in the first half of 2025.

Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop

06/26/2025 | Indium
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A

ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging

05/15/2025 | BUSINESS WIRE
ITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research, have announced a groundbreaking achievement for the integration of ITEN’s micro batteries using A*STAR IME’s cutting-edge advanced packaging platform.

SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics

05/01/2025 | SEMI
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.

Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025

04/30/2025 | SEMI
Worldwide silicon wafer shipments increased 2.2% year-on-year (YoY) to 2,896 million square inches (MSI) from the 2,834 MSI recorded during the same quarter of 2024, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
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