Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
A.R.T. Ltd. Supports Release of IPC-A-600M
June 17, 2025 | A.R.T. Ltd.Estimated reading time: 1 minute
Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of IPC-certified training and IPC authorised distributor, announces the release and availability of IPC-A-600M, the latest revision of the industry’s definitive standard for printed board acceptability.
As an active member of the IPC Product Assurance and IPC-600 Training Committees, A.R.T. Ltd. has contributed directly to the development of this important update. The company has played a key role in shaping IPC-A-600M to reflect current manufacturing challenges and evolving quality requirements.
The IPC-A-600M revision supersedes IPC-A-600K and features dozens of new and updated full-colour photographs and illustrations. It provides enhanced guidance on critical areas such as edge plating, board cavities, edge burrs, and dewetting, as well as refined criteria for conductor thickness, annular ring registration, internal copper penetration, and plating voids. The update is fully aligned with the acceptability requirements outlined in IPC-6012F and IPC-6013E, ensuring consistency within the IPC standards framework.
Debbie McDade, A.R.T. Ltd. Managing Director said: “Our involvement in the IPC-600 Standards Development Committee ensures we contribute directly to standards that reflect current manufacturing challenges and industry needs.
“IPC-A-600M offers enhanced, detailed criteria and updated visuals that help manufacturers and quality teams apply consistent inspection practices. This revision supports maintaining high standards in PCB production as technology and processes evolve. At A.R.T. Ltd., we are committed to providing expert guidance to help the industry adapt and uphold these critical standards.”
A.R.T. Ltd. is now offering IPC-A-600M through its IPC distribution centre services and continues to support the electronics manufacturing sector with expert advice and resources.
Share on:
Suggested Items
New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada
06/19/2025 | Marcy LaRont, I-Connect007IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges.
IPC Update on the Latest U.S.– China Trade Announcement
06/18/2025 | IPCOn June 12, the Trump Administration announced an agreement to implement the framework of the trade deal with China reached earlier in May. Reports indicate the following high-level terms: A 55% combined tariff on imports from China, 10% “reciprocal” tariffs under the International Emergency Economic Powers Act (IEEPA), 20% IEEPA-based fentanyl tariffs, and Existing Section 301 tariffs, which in many cases are 25%.
STI Celebrates Travis Wease’s 10 Years of Dedicated Service
06/17/2025 | STI Electronics, Inc.STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract electronic manufacturing, proudly celebrated the 10-year work anniversary of Travis Wease, Master Instructor and valued team member.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics
06/18/2025 | Chris Mitchell -- Column: The Government CircuitI had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.