Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
June 13, 2025 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
At NVIDIA GTC Paris, Cadence announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA.
Customers will be able to accelerate the development of their industrial technology by leveraging Cadence’s industry-leading solutions, optimized for NVIDIA Grace Blackwell platforms. These innovative solutions include the Fidelity™ CFD Platform, the Spectre® X Simulator, the Voltus™ IC Power Integrity Solution, and the Innovus™ Implementation System, among others.
Europe’s industrial AI ecosystem will be able to leverage Cadence® solvers accelerated by NVIDIA Blackwell systems by up to 80X from the industrial AI cloud. Ascendance is using Cadence Fidelity computational fluid dynamics software and NVIDIA accelerated computing to design the future of aviation, achieving a 20X reduction in simulation runtimes.
In addition, the AI cloud will be built using the NVIDIA Omniverse Blueprint for AI factory design and operations, which leverages the Cadence Reality™ Digital Twin Platform to simulate and optimize the entire operation in a physically accurate virtual environment, enabling engineering teams to build smarter, more reliable facilities. This approach further ensures performance-driven data center design and drives peak operational efficiency.
“Cadence’s solutions, combined with NVIDIA AI infrastructure, are transforming the future of engineering design for the European ecosystem,” said Michael Jackson, corporate vice president and general manager of the System Design and Analysis Group at Cadence. “By making our solutions available on the NVIDIA industrial AI cloud, we’re empowering Europe’s leaders to design intelligent systems faster and with higher quality than ever before."
“The ability to simulate the physical world with extraordinary fidelity and speed is transforming engineering and design,” said Tim Costa, senior director, CUDA-X and CAE at NVIDIA. “With Cadence tools running on the world’s first industrial AI cloud, Europe’s engineers can invent, test and refine the future before it's built.”
Built on 10,000 NVIDIA Blackwell GPUs in NVIDIA DGX B200 systems and NVIDIA RTX Pro Servers, and running NVIDIA CUDA-X, and NVIDIA Omniverse accelerated workloads, this new AI cloud enables Europe’s industrial leaders to leverage Cadence solutions, accelerating applications for semiconductor and system design end markets, including automotive, energy infrastructure and manufacturing.
Cadence recently announced that it is transforming AI-accelerated simulation for multiple markets, including industrial AI, with its new Cadence Millennium™ M2000 Supercomputer. The Millennium M2000 Supercomputer combines industry-leading design software from Cadence and NVIDIA CUDA-X libraries with the NVIDIA Blackwell platform, including the NVIDIA GB200 NVL72 systems, to accelerate silicon, system and drug design.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
08/26/2025 | John Watson -- Column: Elementary, Mr. WatsonI’d like to share a harsh truth, and I say this as a friend: PCB designers are often their own worst enemy. It’s rarely the complexity of the circuit, the last-minute changes from mechanical, the limited enclosure space, or the ever-expanding list of design rules that send projects to the dust heap of failed boards. More often, it's our own decisions, made too quickly and narrowly, and with too little foresight, that sabotage an otherwise good design.
Target Condition: Floor Planning Without a Floor
08/27/2025 | Kelly Dack -- Column: Target ConditionBy a show of hands, how many PCB designers have been asked to start a layout without a board outline, keep-out zones, or even height constraints? How many have had to work within a specific enclosure before the schematic was finalized? If this sounds familiar, you're not alone. Starting a PCB layout without critical constraints is like hiring an interior designer to buy furniture and carpet for a house you haven’t even purchased yet, or, even worse, trying to fit four bedrooms' worth of furniture in a one-room cabin.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
08/22/2025 | Andy Shaughnessy, I-Connect007In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/26/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.