It’s Only Common Sense: Stop Chasing New Customers and Start Keeping the Ones You Have
Driving Innovation: Inner Layer Alignment Methods in PCB Production
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
American Standard Circuits to Exhibit at IMS 2025
June 12, 2025 | American Standard CircuitsEstimated reading time: 1 minute
Anaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.
“IMS is the microwave industry’s premier gathering. It gives us the perfect platform to sit down face-to-face with designers, engineers, and sourcing professionals,” Mr. Vardya said. “Our experts will be on hand to discuss the latest breakthroughs in Ultra-HDI miniaturization, Laminated Liquid-Crystal-Polymer (LCP) RF modules, and advanced flex and rigid-flex interconnect solutions—technologies that are redefining size, weight, and performance for high-frequency systems.
Visitors to the American standard booth (#2336) can:
- Review live samples featuring 10 µm lines/spaces and stacked microvias for next-gen Ultra-HDI layouts
- Explore licensed multilayer LCP constructions that deliver exceptionally low loss up to millimeter-wave frequencies
- Discuss flex and long-format rigid-flex builds—including boards up to 30 inches—with IPC-verified reliability
- Schedule in-depth design reviews or factory tours with ASC’s RF/microwave and UHDI engineering teams
Show attendees can meet the ASC team on the show floor in Booth 2336.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Flex Delivers Advanced Power Management for Next-Generation NVIDIA AI Infrastructure
08/07/2025 | FlexFlex announced a new power shelf system to fast-track 800 VDC power architectures and support the growing demands of AI infrastructure and AI factories.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
Flex Reports Net Sales of $6.6 Billion for Q1 Fiscal 2026
07/28/2025 | Flex"Our first quarter results are a great start to FY26 and a testament to the strength of our strategic focus on high-growth end-markets like data center and power," said Revathi Advaithi, CEO of Flex. "
North American PCB Industry Sales Down 8.6% in June 2025
07/28/2025 | Global Electronics AssociationThe Global Electronics Association announced the June 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.06.