Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
Mycronic’s Global Technologies Acquires Surfx in the US
June 3, 2025 | MycronicEstimated reading time: 1 minute
Mycronic’s Global Technologies division has acquired Surfx Technologies, a company headquartered in the US, providing atmospheric plasma solutions for surface treatment, including cleaning and active oxide removal. These solutions are used in advanced packaging, semiconductor processing, and other electronics manufacturing applications.
Surfx provides plasma cleaning engines for integration into semiconductor packaging equipment, such as thermocompression bonders, hybrid bonders and inkjet printers. The company also provides turnkey plasma cleaning and activation systems for these and other industries, including printed circuit board assembly and medical diagnostics device manufacturing. Surfx’s unique edge is that the systems do not require vacuum, making them suitable for integration into inline production lines.
Surfx was founded in 1999. Mycronic made a minor investment in 2020 and previous to the acquisition owned 7.5 percent of the company. Surfx has 34 employees located in the US and Taiwan, with net sales for 2025 projected at USD 25-30 million.
“Surfx has a unique plasma cleaning solution that is gaining traction in 3D semiconductor die stacking, which is one of the critical enabling technologies behind the AI revolution. With this acquisition, Mycronic invests in leading manufacturing equipment for the semiconductor industry”, says Magnus Marthinsson, Sr VP Global Technologies at Mycronic.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.
SEMICON Taiwan 2025 Hits Record Global Participation Amid AI-Driven Industry Shift
09/03/2025 | SEMISEMICON Taiwan 2025 enters its final countdown, spotlighting the global AI chip boom and the industry’s rapid transformation.
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
2Q25 Foundry Revenue Surges 14.6% to Record High, TSMC’s Market Share Hits 70%
09/01/2025 | TrendForceTrendForce’s latest investigations reveal that global foundry revenue in 2Q25 reached a record US$41.7 billion, up 14.6% QoQ, thanks to China’s consumer subsidy program spurring early stocking, along with upcoming demand for new smartphones, notebooks/PCs, and servers launching in the second half of the year.