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Suggested Items

New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect

09/04/2025 | I-Connect007
In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.

UHDI Fundamentals: UHDI Technology and Industry 4.0

09/03/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.

Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?

09/02/2025 | Dennis Fritz -- Column: Defense Speak Interpreted
In my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: 

Unique Active Memory Computer Purpose-built for AI Science Applications

08/26/2025 | PNNL
With the particular needs of scientists and engineers in mind, researchers at the Department of Energy’s Pacific Northwest National Laboratory have co-designed with Micron a new hardware-software architecture purpose-built for science. 

izmomicro Achieves Breakthrough in Silicon Photonics Packaging, Establishing India's Leadership in Advanced Semiconductor Integration

08/21/2025 | PRNewswire
izmomicro, a specialized division of izmo Ltd., announced a major milestone in silicon photonics packaging, underscoring its role as a pioneer in India's semiconductor ecosystem and advancing the country's position in the global race toward next-generation data and AI infrastructure.
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