Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Micron Pledges AI Education Investment to Accelerate Opportunities for America's Youth

09/05/2025 | Micron
Micron Technology, Inc. is proud to announce its commitment to the White House’s Pledge to America’s Youth: Investing in AI Education, a national initiative aimed at preparing young Americans to lead in an AI-powered future.

American Standard to Participate in European Microwave Week 2025

09/05/2025 | American Standard Circuits
Anaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.

New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect

09/04/2025 | I-Connect007
In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.

UHDI Fundamentals: UHDI Technology and Industry 4.0

09/03/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.

Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?

09/02/2025 | Dennis Fritz -- Column: Defense Speak Interpreted
In my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: 
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in