Infineon to Revolutionize Power Delivery Architecture for Future AI Server Racks with NVIDIA
May 21, 2025 | InfineonEstimated reading time: 2 minutes
Infineon Technologies AG is revolutionizing the power delivery architecture required for future AI data centers. In collaboration with NVIDIA, Infineon is developing the next generation of power systems based on a new architecture with central power generation of 800 V high-voltage direct current (HVDC). The new system architecture significantly increases energy-efficient power distribution across the data center and allows power conversion directly at the AI chip (Graphic Processing Unit, GPU) within the server board. Infineon’s expertise in power conversion solutions from grid to core based on all relevant semiconductor materials silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) is accelerating the roadmap to a full scale HVDC architecture.
This revolutionary step paves the way for the implementation of advanced power delivery architectures in accelerated computing data centers and will further enhance reliability and efficiency. As AI data centers already are going beyond 100,000 individual GPUs, the need for more efficient power delivery is becoming increasingly important. AI data centers will require power outputs of one megawatt (MW) and more per IT rack before the end of the decade. Therefore, the HVDC architecture coupled with high-density multiphase solutions will set a new standard for the industry, driving the development of high-quality components and power distribution systems.
“Infineon is driving innovation in artificial intelligence,” said Adam White, Division President Power & Sensor Systems at Infineon. “The combination of Infineon's application and system know-how in powering AI from grid to core, combined with NVIDIA’s world-leading expertise in accelerated computing, paves the way for a new standard for power architecture in AI data centers to enable faster, more efficient and scalable AI infrastructure.”
"The new 800V HVDC system architecture delivers high reliability, energy-efficient power distribution across the data center,” said Gabriele Gorla, vice president of system engineering at NVIDIA. “Through this innovative approach, NVIDIA is able to optimize the energy consumption of our advanced AI infrastructure, which supports our commitment to sustainability while also delivering the performance and scalability required for the next generation of AI workloads.”
At present, the power supply in AI data centers is decentralized. This means that the AI chips are supplied with power by a large number of power supply units (PSU). The future system architecture will be centralized, making the best possible use of the constraint space in a server rack. This will increase the importance of leading-edge power semiconductor solutions using fewest power conversion stages and allowing upgrades to even higher distribution voltages.
Infineon is a leader in power semiconductor solutions and systems integration. The company expects the proportion of power semiconductors in a centralized HVDC architecture to be similar or higher than in today's AC distribution architecture. Additionally, to the scaling of the HVDC power architecture, Infineon continues to support state of the art DCDC multiphase solutions and intermediate architectures for hyperscalers and AI data center operators with a broad product portfolio based on all relevant semiconductor materials along the entire power flow.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
AT&S Launches HiPower 5.0 Research Project for Smart Electric Transport
08/19/2025 | AT&SAustria’s leading microelectronics manufacturer AT&S is participating as a strategic partner in the EU research project HiPower 5.0, which will develop new solutions for semiconductor integration and control systems for highly compact and smart electric drive components.
Driving the New Era of AI and IoT with Powercast's One-Stop Shop for Wireless Power Solutions
08/18/2025 | PRNewswireAs AI and IoT drive explosive growth, Powercast is redefining how industries power critical infrastructure. By eliminating disposable batteries through long-range RF wireless technology, Powercast delivers cost-efficient, scalable, and sustainable energy solutions tailored to meet the demands of our increasingly connected world.
Magnachip Semiconductor Announces YJ Kim to Step Down as CEO; Current Board Chairman Camillo Martino Appointed Interim CEO
08/14/2025 | PR NewswireMagnachip Semiconductor Corporation today announced that YJ Kim has agreed to step down as CEO and as a member of the Board of Directors, effective immediately. Camillo Martino, Chairman of the Board of Directors, has also been appointed Interim Chief Executive Officer, effective immediately.
Alpha and Omega Semiconductor Announces Advanced eFuse that Meets High Reliability Server Application Requirements
08/13/2025 | Alpha and Omega SemiconductorAlpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, announced the release of its AOZ17517QI series, a 60A eFuse in a compact 5mm x 5mm QFN package.
Advint and SanRex Expand High-Performance DC Rectifier Access for North American PCB Fabricators
08/12/2025 | Advint IncorporatedAdvint Incorporated has entered a strategic partnership with SanRex Corporation, enhancing access to industrial-grade DC rectifiers for the US printed circuit board industry. With a legacy of power innovation and performance across the globe, SanRex rectifiers are available through Advint’s proficient distribution network.