Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Thermal Interface Materials – Transition to High-Performance Materials

08/18/2025 | IDTechEx
IDTechEx forecasts that the market size of thermal interface materials (TIMs) will exceed US$7 billion, covering multiple industries including EV batteries, EV power electronics (TIM1 and TIM2), data centers, advanced semiconductor packaging (TIM1 and TIM1.5), ADAS sensors, consumer electronics, and 5G.

Koh Young Appoints George Hsu to Lead Newly Opened Taiwan Office to Drive Semiconductor and Advanced Packaging Growth

08/18/2025 | Koh Young
Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the appointment of George Hsu as Managing Director of Koh Young Taiwan, its newly established branch office in Zhubei City, Hsinchu County.

Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India

08/14/2025 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.

Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium

08/12/2025 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the 36th Annual Electronics Packaging Symposium (EPS), hosted at the GE Aerospace Research Campus in Niskayuna, New York, on September 03-04, 2025.

Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging

08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007
AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in