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Results of the AT&S Annual General Meeting: Andy Mattes appointed Chairman of the Supervisory Board

07/04/2025 | AT&S
Andy Mattes was newly elected to the Supervisory Board of AT&S Austria Technologie und Systemtechnik Aktiengesellschaft and is appointed until the 36th Annual General Meeting 2030. Georg Hansis was re-elected.

High Density Packaging User Group (HDP) Welcomes Lincstech as New Member

07/01/2025 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.

Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation

07/01/2025 | Zhen Ding
To advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.

PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025

06/27/2025 | PRNewswire
The Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.

Summit Interconnect Participates in PCBAA Annual Meeting to Advance U.S. Electronics Policy

06/26/2025 | Summit Interconnect, Inc.
Summit Interconnect was proud to participate in the 2025 Annual Meeting of the Printed Circuit Board Association of America (PCBAA), held in Washington, D.C. this June.
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