Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
DuPont to Showcase Advanced Semiconductor Wet Etching Innovations at the Surface Preparation and Cleaning Conference
May 13, 2025 | DuPontEstimated reading time: 2 minutes
DuPont announced that it will present its latest developments in semiconductor wet etching technologies at the upcoming Surface Preparation and Cleaning Conference (SPCC) in Chandler, Arizona, beginning May 20.
Continued growth in advanced computing and AI is driving demand for data storage in servers, solid state drives and consumer electronics. As semiconductor fabricators develop faster and more power-efficient next-generation memory chips to support these applications, there are numerous technical challenges including shrinking design rules, narrower feature sizes and higher aspect ratios. Novel wet etching processes are emerging as a key enabler for 3D NAND flash memory design, requiring new etchant materials.
“DuPont has been working closely with leading semiconductor fabricators to understand emerging challenges and requirements in selective etching processes,” said Young Bae, global business director, Advanced Cleans & Slurry Technologies, DuPont. “By leveraging our core competencies in selective cleaning technologies, we have successfully expanded our product offerings to feature high selectivity etchants including selective molybdenum etchants.”
One example of where novel etchants are being used is supporting the vertical extension of 3D NAND memories that contain more layers of alternating tungsten word lines and dielectrics. As this taller structure presents significant challenges for the dry etching process of high aspect ratio channels and interconnects, there has been a shift toward vertical densification with thinner word lines using molybdenum as an alternative for tungsten. Since traditional etching processes developed for tungsten word lines are not applicable for molybdenum word lines, it is critical to create high selectivity etchants specifically for molybdenum. DuPont’s developments can also enable combining the etching and cleaning processes into a single step, streamlining the process while improving performance and extending the lifespan of the etchant bath and its shelf life.
At SPCC, DuPont’s experts will present technical sessions to share advancements in a new molybdenum etchant that is designed with a multi-dissolver system to enhance the dissolution of molybdenum oxides, improving top-to-bottom etch uniformity for 3D NAND fabrication. DuPont representatives will also present developments in a high selectivity silicon etchant that offers high etch rates and excellent compatibility with silicon-germanium for backside power delivery network applications. This research is informing new product development for DuPont’s EtchSolv™ precision etchant family.
“We are excited to share our latest research in high selectivity etchants for advanced semiconductor manufacturing at SPCC,” said Bae. “Precision etching materials will contribute to the overall performance, efficiency, and reliability of advanced semiconductor devices, particularly in areas like 3D NAND/3D DRAM technology, where vertically stacked memory cells are essential for achieving greater density and faster performance.”
DuPont will have an exhibit booth at SPCC to discuss EtchSolv™ etchants and semiconductor cleans.
Share on:
Suggested Items
The Chemical Connection: Through-glass Vias in Glass Substrates
06/24/2025 | Don Ball -- Column: The Chemical ConnectionThis month’s theme is vias and how best to ensure via quality and reliability. I don’t have much expertise in this process area or much to contribute that most of you don’t already know. However, I’ve recently become peripherally involved in a via technology that may be of more than academic interest to some of us. It entails putting vias in a material not usually associated with PCB manufacturing: through-glass vias (TGVs) in glass substrates.
In Pursuit of Perfection: Defect Reduction—May 2025 PCB007 Magazine Now Available
05/15/2025 | I-Connect007 Editorial TeamFor bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In the May 2025 issue of PCB007 Magazine, we examine the imaging, etching, and plating processes, as well as product traceability on the shop floor, providing information and insight into how you can reduce your defects and increase yields.
The Chemical Connection: Common Misconceptions in Wet Processing
04/28/2025 | Don Ball -- Column: The Chemical ConnectionInitially, I thought an April Fool’s column would be fun this month. I could highlight some of the crazier ideas and misconceptions I’ve witnessed over the years from potential customers and we could all have a good laugh. For example, there was a first-time buyer of a ferric chloride etcher (with no regeneration system) who was astonished to learn that he had to put fresh etchant in the system occasionally to maintain production.
Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley
04/17/2025 | PRNewswireLam Research Corp. announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.
Chemcut Corporation Announces Atlantic Micro Tool Expanded Sales Territory
03/11/2025 | Chemcut CorporationChemcut Corporation, the US based manufacturer of Wet Process Equipment, has expanded Atlantic Micro Tools sales territory to include DE, MD, VA, WV, NY, PA, NC, SC, TN, GA, AL, FL, MS, Ontario. Atlantic Micro Tool has represented Chemcut for over 15 years in the States of ME, NH, VT, RI, CT, NJ, New York City MA, NY counties of Nassau, Suffolk, Quebec & Eastern Ontario.