BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services
May 12, 2025 | BEST Inc.Estimated reading time: 1 minute

BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.
Our component salvaging services include BGA’s, QFN’s and LGA’s, BGA re-balling, and reconditioning. All are performed with strict MSD and ESD safeguards. We also offer remarking, bake-out, and packaging in trays, tubes, or tape and reel in accordance with EIA-481 standards. The process involves mechanical disassembly of electronic devices, selective removal of soldered components, reconditioning of leads and pads, laser marking for traceability, and packaging optimized for automated circuit board assembly.
BEST specializes in properly processing and preparing printed circuit boards, ensuring components are safely removed and correctly conditioned for re-insertion into the manufacturing flow. Harvesting components from PCBs helps alleviate shortages of high-value or hard-to-source electronic devices. Our expertise includes reconditioning ball grid arrays, ultra-fine pitch QFPs, QFNs, LGAs, and other electronic packages, providing end-users with confidence in our high-quality reclaiming processes. Our extensive experience in BGA removal, replacement, and reballing makes our salvaging services particularly effective and valuable. With years of industry expertise, we deliver the highest yields while maintaining strict standards of quality and reliability.
In conjunction with our ongoing electronic component reclamation activities, BEST is actively involved with the development of the IPC-7712 Component Reclaim Standard to advance circularity within the electronics manufacturing industry and expand the ability of component reuse as opposed to recycling of electronic waste.
The importance of using high-quality workmanship standards throughout the component reclamation process is essential. This serves to ensure the integrity of the component supply chain, facilitating environmental responsible practices, and reducing reliance on energy intensive fabrication of new electronic components.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Missile Strike on Ukraine Hits Flex Facility
08/22/2025 | FlexOn the morning of August 21, 2025, our facility in Mukachevo, Ukraine, was damaged during a missile strike. Our emergency protocols were executed to ensure the full evacuation of the site.
TPCA Establishes Thailand PCB Academy in Bangkok
08/22/2025 | TPCAA distinguished delegation of distinguished guests from industry, government, academia, and research in Taiwan and Thailand, including representatives from the Ministry of Higher Education, Science, Research, and Innovation (MHESI), the Board of Investment of Thailand (BOI), and the Taipei Economic and Cultural Office in Thailand (TECO), as well as professors from several Thai universities and member companies, attended the historic occasion.
SINBON Celebrates Opening of New US Manufacturing Facility
08/21/2025 | PRNewswireLeading electronics system integrator SINBON Electronics Co., Ltd. held an opening ceremony on August 18 to celebrate its new 59,000-square-foot facility in Clayton, Ohio.
Axxon-Mycronic to Showcase Advanced Coating, Dispensing, and Backend Solutions at SMTA Guadalajara 2025
08/21/2025 | Axxon-MycronicAxxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, to announce its participation at the 2025 SMTA Guadalajara EXPO, taking place September 17-18, 2025 at the Guadalajara Expo & Tech Forum.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.