I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 9, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Trade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one.
It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Hunting for Clues: Feng Xue Solving Circuit Board 'Crimes' With AOI Standard
Published May 8
My ex-wife was a big fan of Agatha Christie’s Poirot, a PBS series about a Belgian detective named Hercule Poirot who always catches the bad guy. And as IPC’s Linda Stepanich explains in this IPC Community article, IPC standards committees often rely on the A-Team Hercule when creating standards to detect defects with AOI. Check it out.
Voices of the Industry: Alpha Circuit
Published May 6
Many are worried about the effects of tariffs on their bottom line in the short and long term. In this interview, Alpha Circuit CEO Prashant Patel explains how tariffs and the changing economy are impacting his company and the overall electronics manufacturing industry. As the Chinese say, “May you live in interesting times.”
Nick Koop Launches IPC Flex Design Class
Published May 6
More of our readers are moving into flex and rigid-flex design every year. They need more knowledge, but there aren’t many flex design classes available. TTM’s Nick Koop is filling the void with his new IPC class, Flex and Rigid-Flex Design for Manufacturability. This two-week course begins May 12, so if you’re working with flex or rigid-flex, don’t miss out.
Navigating Global Manufacturing in an Era of Uncertainty
Published May 7
Our old friend Phil Stoten is now the host of the IPC podcast MADE IN EUROPE. Phil always has his finger on the pulse of European electronics manufacturing, and he shares his thoughts on the current outlook on the continent. As he says, “For European manufacturing, adaptability is no longer just an advantage; it's essential for survival.”
Driving Innovation: Registration in PCB Production Throughout the Process
Published May 6
If you’ve ever encountered challenges with registration when fabricating a PCB, you’ll understand why columnist Simon Khesin compares this process to building the perfect cheeseburger: “You wouldn’t want your tomato sliding off one side, the patty leaning in the opposite direction, and the cheese hanging unevenly.” Speaking of cheeseburgers, is it time for lunch?
Suggested Items
All Flex Solutions Upgrades Lamination Layup
06/19/2025 | All Flex SolutionsAll Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
06/18/2025 | SEMIFlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing.
Flex CEO Sees US Manufacturing Resurgence
06/18/2025 | I-Connect007In a June 16 interview on Bloomberg Open Interest, Flex CEO Revathi Advaithi said the supply chain is already shifting, with more goods now being manufactured in the U.S.
American Standard Circuits to Exhibit at IMS 2025
06/12/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.