Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
May 6, 2025 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas. Now in its 75th year, ECTC is the premier international event dedicated to microelectronic packaging, components, and systems, bringing together global experts for collaboration, education, and innovation.
As the exclusive sponsor of the ECTC Gala, Koh Young is proud to continue its commitment to the advanced packaging community. The 2025 technical program features groundbreaking work in assembly and manufacturing technologies, heterogeneous integration, wafer-level packaging, and semiconductor inspection. Attendees will gain insights from industry leaders through technical sessions, panels, plenaries, and EPS seminars, as well as in the exhibition area.
The ECTC Exhibition offers a vital opportunity for engineers, technologists, and decision makers to engage directly with Koh Young and other technology leaders. Visit booth 419 to learn how our AI-powered 3D inspection solutions are solving critical challenges in advanced packaging and semiconductor applications. Our experts will be on hand to discuss how True 3D measurement and automated process control are helping manufacturers improve quality, reduce waste, and achieve zero-defect production goals.
“As advanced packaging and semiconductor technologies continue to push the limits of precision and reliability, manufacturers need inspection solutions that can keep pace,” said Brent Fischthal, Head of Global Marketing at Koh Young. “At ECTC 2025, we’re excited to connect with engineers and decision makers to explore how our AI-powered 3D metrology solutions enable smarter process control and higher yield. We're also pleased to introduce our new sales partner, NTV USA, who will help us expand support for customers in these critical application areas.”
Share on:
Suggested Items
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
NVIDIA RTX PRO 6000 Shipments Expected to Rise Amid Market Uncertainties
06/24/2025 | TrendForceThe NVIDIA RTX PRO 6000 has recently generated significant buzz in the market, with expectations running high for strong shipment performance driven by solid demand.
Green Circuits Boosts Test Capacity with New Takaya APT-1600FD System
06/24/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the purchase of its fourth Takaya APT-1600FD Double-sided Flying Probe Test System.
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
France, Spain Renew Commitment to the Airbus A400M Programme
06/17/2025 | AirbusAirbus and OCCAR have reached an agreement with the A400M launch nations to secure production for the programme for the foreseeable future, improve the cost of operations, and jointly develop new capabilities.