The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
April 24, 2025 | LITEON TechnologyEstimated reading time: 1 minute
LITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Building upon their initial collaboration in 2023, which focused on developing low-carbon Flexible Printed Circuits (FPC) technology for commercial applications, this new agreement expands the scope to include equipment investment with integration into existing production lines in cooperative factories. The adoption of Elephantech’s proprietary technology will help inject new momentum into building a more sustainable supply chain.
Roger Chen, Director of LITEON+, the company's startup platform, stated: "The signing of our second MoU marks a new milestone in our partnership with Elephantech. We're moving beyond early-stage product applications in equipment investment. Through this advancement, we will be able to embed sustainability deeper into our operations and continue leading the industry in building sustainable competitiveness."
Since its establishment in 2023, LITEON+ has been dedicated to nurturing promising global startups that share a vision for sustainability. The platform provides resources, technology and accesses to international market expansion. Elephantech, as one of LITEON+'s first strategic partners, has been instrumental in developing innovative applications for low-carbon PCB technology.
Elephantech's agile startup model has rapidly accelerated new technology implementation. In just six months, both companies have successfully validated the feasibility of applying Elephantech’s technology to multilayer PCBs. Under this new MoU, LITEON plans to invest in Elephantech's proprietary PCB manufacturing equipment and implement it into existing cooperative factories to comprehensively upgrade production lines. This collaboration will help to reduce the carbon footprint of consumer electronics production, cut water and copper consumption, minimize environmental impact—ultimately enhancing sustainability throughout the supply chain and setting a new benchmark for green manufacturing.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.