Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

The Future of Advanced Packaging Inspection Is X-ray

04/22/2025 | David Kruidhof and Kevin Jan, Comet Yxlon
Driven by smartphones, high-performance computers, and artificial intelligence, the global demand for high-end computing power is constantly rising. The industry is also facing demands for miniaturization, which creates the need for ever-smaller defect recognition. The semiconductor industry has been identifying and solving these challenges for decades using various optical inspection and SEM tools.

Yamaha Boosts YRi-V AOI Productivity with 3D Component Update

04/22/2025 | Yamaha Robotics
Yamaha Robotics Europe SMT Section has introduced instantaneous 3D component update, included with the latest software release for YRi-V automatic optical inspection (AOI) systems, letting users optimise inspection programs without stopping production. 

ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai

04/18/2025 | ViTrox Technologies
ViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).

Saki America, Appoints Mario Ramírez Galindo as Project Engineer in Mexico

04/17/2025 | Saki America,
Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the appointment of Mario Ramírez Galindo as Project Engineer in Mexico. In this role, Mario will support Saki’s customers by providing technical expertise, process optimization, and project management to enhance manufacturing efficiency and inspection accuracy.

New High Power 3D AXI for Power Electronics from Test Research, Inc.

04/17/2025 | TRI
Test Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in