Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
GlobalFoundries Accelerates GHG Reductions Commitments with Near Term Science-Based Target
April 23, 2025 | GlobalFoundriesEstimated reading time: 1 minute
GlobalFoundries announced it will accelerate its near-term greenhouse gas (GHG) emission reduction goals, enhancing the company’s commitment to sustainable operations and further supporting the sustainability leadership of partners including Apple and Infineon Technologies AG. GF’s revised targets will be set in line with Science Based Target Initiative (SBTi) standards.
GF is updating its Journey to Zero Carbon pledge with the accelerated commitment to reduce total GHG emissions by 42% from 2021 to 2030, up from the previous target of 25%, even as the company continues to expand its global semiconductor manufacturing capacity. GF is on track to meet this more ambitious 42% reduction goal, which will be accomplished through a comprehensive mix of energy efficiency improvements, state-of-the-art emissions controls, expanded use of alternative chemistries, and use of lower-carbon power across its fabs in the U.S., Germany and Singapore.
As part of this pledge, GF has committed to set its GHG emission reduction target in alignment with SBTi, widely considered the gold standard for science-based carbon reduction targets.
“Addressing today’s sustainability challenges is no small task, and GF has a strong track record of advancing responsible manufacturing and helping our customers achieve their sustainability goals,” said Niels Anderskouv, chief business officer and incoming president and chief operating officer at GF. “The essential chips we manufacture are in countless technologies and devices around the world. Our commitment to SBTi, and its vigilant framework for meaningful greenhouse gas emissions reductions, is both the right thing to do and another way for GF to be an environmentally responsible partner to our customers and communities.”
In partnering with Apple, GF is enhancing the sustainability of its semiconductor manufacturing operations and further reducing fluorinated GHG emissions, which have global warming potential thousands of times greater than that of CO2. GF has also been partnering with Infineon to set and meet more ambitious GHG reduction targets, in alignment with Infineon’s SBTi plans to address climate change across its entire value chain.
As GF works with SBTi on its near-term GHG emission reduction target, the company remains committed to its previously stated goals of achieving net-zero GHG emissions and 100% carbon-neutral power by 2050. Net-zero is a widely recognized global objective aimed at reducing emissions and supporting long-term environmental sustainability.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.