Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
September 10, 2025 | I-Connect007Estimated reading time: 1 minute
I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra high density interconnect (UHDI).
The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
In this first episode, John introduces listeners to the fundamentals of UHDI: what it is, why it matters, and how it’s redefining the future of PCB design and manufacturing. He also explains the practical advantages UHDI brings to solving design challenges and shares why designers and manufacturers alike are excited and intrigued by its potential.
Throughout the series, listeners can expect valuable insights, expert perspectives, and real-world applications to help them better understand UHDI and prepare for its expanding role in the electronics ecosystem.
Episodes are paired with downloadable educational takeaways, providing an additional resource to support professional growth.
The On the Line With... American Standard Circuits UHDI podcast series episode one is available now on the I-Connect007 platform and major podcast directories.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Zuken Opens New E3.series Development Center
08/29/2025 | ZukenZuken is relocating the E3.series development team to a new, state-of-the-art facility in Neu-Ulm. Effective September 1, 2025, the new headquarters will be located at Meininger Allee 5, 89231 Neu-Ulm, Germany.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/28/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.
New Podcast Series Launches: Optimize the Interconnect
07/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.