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The Chemical Connection: Getting the Best from Your Cupric Chloride Etchant

12/04/2024 | Don Ball -- Column: The Chemical Connection
Over the past several months, we have received a lot of questions from our customers about cupric chloride etching—mostly about how to improve etch quality, but also about process problems. Most of them were easily dealt with, but the questions arose because the people involved in running the etching process were not aware of the finer nuances involved in using cupric chloride as the primary etchant. (They don’t have courses on etching in most colleges and trade schools.) I thought this might be a good time to summarize some things I have learned in my 50 years of experience with cupric chloride etching and clear up some of the confusion.

NASA’s Europa Clipper: Millions of Miles Down, Instruments Deploying

11/26/2024 | NASA
Headed to Jupiter’s moon Europa, the spacecraft is operating without a hitch and will reach Mars in just three months for a gravity assist.

Happy’s Tech Talk #32: Three Simple Ways to Manage and Control Wet Processes

09/03/2024 | Happy Holden -- Column: Happy’s Tech Talk
My three favorite sensors for wet process control are process concentrations with specific gravity, plating replenishment based on ampere-hours, and active concentrations with color indicators. To start enrolling in wet process control, I advise doing a process audit (Table 1) with a real time analyzer, which is a conductivity probe and a thermometer. You can also add a hydrometer, a multimeter, and a color analyzer.

The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading

08/07/2024 | Don Ball -- Column: The Chemical Connection
This month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.

The Chemical Connection: Chemical and Equipment Control of High-density Circuits

07/02/2024 | Don Ball -- Column: The Chemical Connection
As line and space requirements and specifications get increasingly tighter, it is obvious that at some point you must consider tightening the controls on the chemical and equipment parameters (temperature, specific gravity, conveyor speed, etc.) of your production lines to meet those requirements. For the purposes of this discussion let’s consider line and space requirements of 75 µm (0.003") or less with tolerances of ±5% as the tipping point for serious consideration of tighter chemistry and equipment control.
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