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Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
April 17, 2025 | BUSINESS WIREEstimated reading time: 1 minute
As part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio. This expansion into Northeast Ohio marks a significant step in fostering academic and industry collaboration to accelerate innovation and workforce development in the U.S. semiconductor sector.
“This acquisition supports our mission to expand U.S. semiconductor capacity with secure, high-reliability solutions,” said Marti McCurdy, CEO of Spirit Electronics. “Partnering with LCCC allows us to invest directly in the future talent pipeline and emerging technologies that are critical to national security and domestic innovation.”
Located within the LCCC campus, SMART Microsystems will serve as a hub for advanced research and education in materials, MEMS, and advanced packaging technologies, including 2.5D and 3D integration.
“We are proud to collaborate with Spirit Electronics to bring new opportunities to Northeast Ohio,” said Dr. Marcia Ballinger, President of Lorain County Community College. “This partnership enhances our ability to prepare students for high-tech careers while contributing to the growth of a robust semiconductor ecosystem in our region and beyond.”
Together, Spirit Electronics and LCCC are laying the foundation for a resilient, innovation-driven semiconductor future.
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Julia McCaffrey - NCAB GroupSuggested Items
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
10/10/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025.