Avnet Technology Links STMicroelectronics’ STM32 Microcontrollers
April 11, 2025 | AvnetEstimated reading time: Less than a minute
Design engineers who struggle with chip down design will now be able to quickly prototype and deploy their projects based on STM32 series of microcontrollers, specifically the STM32F7 and STM32N6 series.
Avnet Displays’ new technology solution quickly links STMicroelectronics’ powerful microcontroller solutions to advanced display technology providing a seamless adapter interface.
The technology solution creates a plug-and-play experience that eliminates the typical hurdles in connecting displays to microcontrollers, enabling engineers to focus on innovation rather than interface complexity. The fast and reliable connection provides a secure, high-speed link between STM32 evaluation kits and displays.
The solution is designed to support STM32 microcontrollers and a wide range of display sizes from 4” to 10.1” as well as interfaces. These include the standard options of MIPI (Mobile Industry Processor Interface), RGB (red, green and blue) and SPI (Serial Peripheral Interface) for different applications.
An effortless integration comes with ready-to-use adapters, pre-implemented drivers and optimized software which means reduced development time and lower cost due to lower hardware complexity.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.