Adaptsys, APP Systems Services Announce Strategic Partnership in Singapore
April 8, 2025 | AdaptsysEstimated reading time: 1 minute
Adaptsys has formed a strategic partnership with APP System Services, bringing our innovative Re-flex II inline carrier tape forming technology to customers in Singapore.
This collaboration represents an exciting step forward in our global growth and our commitment to providing localised support in one of Asia’s most vibrant electronics manufacturing markets.
Adaptsys is thrilled to announce our partnership with APP in Singapore, says Duncan Milroy, International Sales Manager at Adaptsys. This collaboration will allow us to bring our innovative Re-flex inline carrier tape forming technology directly to customers within Singapore. The Re-flex system, with its patented ability to form carrier tape inline, offers significant advantages by reducing material costs, simplifying logistics, and improving taping efficiencies for all users in the Singaporean market. We are confident that APP’s local expertise will provide excellent sales and support for our groundbreaking solution.
With APP’s strong local presence and technical knowledge, customers can now benefit from direct access to a solution that is reshaping tape and reel packing process for electronic components by delivering cost savings, greater efficiency, and reduced environmental impact.
Both companies will be exhibiting at SEMICON Southeast Asia in Singapore. You’ll find Adaptsys at Booth B1917 and APP System Services at Booth B1924. We welcome visitors to drop by or book a meeting with us to explore how Re-flex II can enhance your taping operations.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Nick Koop Launches IPC Flex Design Class
05/06/2025 | Andy Shaughnessy, Design007 MagazineNick Koop is director of flex technology for TTM Technologies, and he’s been a staple of IPC’s flex committees for decades. He’s also a longtime flex design instructor, and he’s about to debut a new IPC class, Flex and Rigid-Flex Design for Manufacturability, which will run May 12–21. In this interview, Nick tells us about this new class and what attendees can expect to learn.
ASC Sunstone Circuits to Exhibit at PCB Detroit 2025
05/05/2025 | ASC SunstoneASC Sunstone Circuits will be exhibiting at the inaugural session of PCB Detroit to be held on June 2 and 3 on the campus of Wayne State University.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/02/2025 | Marcy LaRont, PCB007 MagazineIn our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.