DuPont Enhances Optical Silicone Technical Capabilities in Taiwan
April 7, 2025 | DuPontEstimated reading time: 1 minute
DuPont announced the enhancement and expansion of its Optical Silicone Lab at its Taoyuan site in Taiwan. With the newly added capability, DuPont aims to support innovation, focusing on three objectives: accelerating the evaluation of optical silicone products, optimizing application processes, and refining the design window for devices.
“The investment in our Optical Silicone Lab reflects our commitment to helping customers accelerate their product development cycles, troubleshoot challenges, improve performance, and drive next-generation product innovation,” said Linda Gu, Asia-Pacific Sales Leader, Laird, DuPont Interconnect Solutions (ICS). “We are proud of the work being done in the Taoyuan site and eager to offer this one-stop service, including product development, testing, and optimization to our customers.”
“Close collaboration is essential between manufacturers and researchers in developing lab-originated materials that improve the thermal stability, performance, and long-term reliability of optical devices,” says Joyce Yeh, Regional Sales Manager, Silicones, Laird, ICS. Featuring advanced technology and state-of-the-art equipment, this lab serves as an innovation hub, allowing customers in the optical industry to expedite their development processes through real-time evaluations and thorough assessments of test results, ultimately validating their planned optical applications.
As an extended testing and analytical lab for our customers, DuPont Optical Silicone Lab is also equipped with scientists and engineers to provide expertise in guiding customers on how to evaluate new materials more efficiently, analyze test findings for faster reporting, and explore additional innovations in optical silicone materials. Automotive and consumer electronics customers will be the primary users.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
TDK Demonstrates the World's First ‘Spin Photo Detector’ Capable of 10X Data Transmission Speeds for the Next Generation of AI
04/16/2025 | PRNewswireThis new device is expected to be a key driver for implementing photoelectric conversion technology that boosts data transmission and data processing speed, particularly in AI applications, while simultaneously reducing power consumption.
IEEE Study Leverages Silicon Photonics for Scalable and Sustainable AI Hardware
04/14/2025 | PRNewswireThe emergence of AI has profoundly transformed numerous industries. Driven by deep learning technology and Big Data, AI requires significant processing power for training its models. While the existing AI infrastructure relies on graphical processing units (GPUs), the substantial processing demands and energy expenses associated with its operation remain key challenges.
The World's Smallest PPG Sensor Head
04/04/2025 | BUSINESS WIRESCIVAX Corporation and TSLC Corporation, a SemiLEDs Corporation wholly owned company announced that SCIVAX+TSLC have developed the world's smallest PPG (PhotoPlethysmoGraphy)* sensor head, which will be presented at the display related technology exhibition ”Touch Taiwan” to be held in Taipei, Taiwan from April 16 to 18, 2025. The samples of the PPG sensor head for evaluation will begin in April 2025.
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
04/02/2025 | TeradyneTeradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics.