Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Real Time with... IPC APEX EXPO 2025: Transforming Engineering With Digital Solutions from Zuken
March 27, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Bob Potock discusses Zuken's focus on digital engineering and a move away from traditional document-based processes to model-based designs. This change improves product definition, reduces design errors, and optimizes product parameters. Bob notes that the IPC-2581 standard is crucial for connecting designs, while AI enhances design efficiency. Connected manufacturing links design outputs directly to machines, reducing human error. The concept of digital twins is also discussed, showcasing AI's role in design optimization.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Circuit Check Acquires Solution Sources Programming (SSP) to Become a Full-Service Test and Programming Provider with Expanded Presence in Silicon Valley
08/05/2025 | PR NewswireCircuit Check, a global leader in turnkey functional test systems across medical, automotive, industrial, military/aerospace, and emerging AI applications, today announced the acquisition of Solution Sources Programming (SSP), a trusted Silicon Valley provider of integrated test and programming solutions for over 35 years.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
Setting Design Constraints Effectively
07/31/2025 | Stephen V. Chavez, Siemens EDAPCB design requires controlling energy within the medium of a PCB. The manner in which we control the chaos of energy is by implementing and utilizing physical and electrical rules, known as constraints, along with a specific structure and material(s) that make up what is known as the foundation of the design. These rules govern everything within the PCB structure and generally fall into two camps: performance and manufacturability. Setting this foundation correctly is extremely important and the key to success.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Ansys 2025 R2 Enables Next-Level Productivity by Leveraging AI, Smart Automation, and Broader On-Demand Capabilities
07/30/2025 | PRNewswireAnsys, now part of Synopsys, announced 2025 R2, featuring new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility.