It’s Only Common Sense: Trust Is All You Need
Dan’s Biz Bookshelf: ‘The Future of Sales'
Driving Innovation: Traceability in PCB Production
Global Chiplets Market to Grow at 41.9% CAGR from 2024 to 2029
March 20, 2025 | PRNewswireEstimated reading time: 1 minute
According to the latest study from BCC Research, "Global Chiplets Market" will reach $42.8 billion by the end of 2029, growing at a CAGR of 41.9% from 2024 to 2029.
This report focuses on five processor segments: CPUs, GPUs, FPGAs, AI-ASIC coprocessors, and APUs. It segments the market by packaging technologies such as 2.5D/3D, SiP, WLCSP, FCCSP, FCBGA and FO. The report also segments the market by end user, including enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. It also considers the IT, telecommunications, scientific research and gaming sectors. Covering the regions of North America, Europe, Asia-Pacific and the rest of the world (RoW), the study also examines market drivers, macroeconomic factors, and regional dynamics.
The growing demand for high-performance computing (HPC) and the expansion of 5G technology underscore the relevance of this report in today's world. The chiplet market is experiencing significant growth due to the increasing need for high-performance, energy-efficient, and modular computing solutions. As the semiconductor industry faces challenges in further scaling down transistor sizes, chiplets offer a promising solution to overcome these limitations, enabling the development of more powerful and sophisticated computing systems.
The factors driving the market include:
High-Performance Computing (HPC): HPC uses supercomputers to solve complex problems in various fields, such as research and finance. Chiplets enhance HPC by integrating multiple specialized units on a single board, improving scalability and performance for tasks such as AI and scientific simulations.
5G's Growing Need for Chiplets: 5G technology requires high-speed, low-latency communication. Chiplets provide a modular solution, integrating processing, memory, and connectivity into one package. This optimizes performance and reduces power consumption, which is essential for supporting the massive volume of data traffic and numbers of connected devices in 5G networks.
Share on:
Suggested Items
IDC Increases its PC and Tablet Forecasts Despite Tariff Uncertainty
06/02/2025 | IDCAfter recording strong results in the first quarter of 2025, IDC is increasing its traditional PC forecast for 2025 — this comes despite the significant impact that US tariffs have had on its trading partners’ market sentiment.
Global Smart Manufacturing Market Size to Reach $787.54 Billion by 2030
06/02/2025 | PRNewswireThe global Smart Manufacturing Market Size is projected to be valued at USD 297.20 billion in 2023 and reach $787.54 billion by 2030, growing at a CAGR of 14.9% according to a new report by The Research Insights.
Micro LED Expands Beyond Displays, Unlocking New Opportunities in Transparent and Non-Display Applications
05/30/2025 | TrendForceTrendForce forecasts that the chip market value for Micro LED display applications will reach US$740 million by 2029, with a CAGR of 93% from 2024 to 2029.
VJ Electronix Appoints Marco Cruz as Mexico Regional Sales Manager
05/30/2025 | VJ ElectronixVJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce the appointment of Marco Antonio Cruz Tovar as Mexico Regional Sales Manager.
Arrow Electronics Earns Dual Honors as Dell Technologies Partner of the Year
05/29/2025 | BUSINESS WIREGlobal technology solutions provider Arrow Electronics has received two prestigious awards from Dell Technologies: 2025 OEM Solutions Partner of the Year and 2025 North America Distributor of the Year. The awards were announced at Dell Technologies World, held in Las Vegas in late May.